3D IC Technology--An Assessment (Technical Insights)

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The research service discusses global trends 3D IC technology. It discusses in detail, development and adoption trends of 3D IC technology focusing on various aspects of the technology across the value chain. It further highlights the new developments in this sector.

Table of Contents

3D IC Technology--An Assessment (Technical Insights), Executive SummaryScope and MethodologyScopeMethodologyResearch Overview & Key Research FindingsResearch OverviewKey Research Findings3D IC Technology--An Assessment (Technical Insights), 3D IC--A Technology OutlookTechnology Primer and Applications ScenarioDominant Packaging Platforms 3D IC--An Industry OutlookApplication Scenario3D IC Technology Performance EvaluationTechnology Benefits and LimitationsStrategic Assessment of Individual Performance Metrics3D IC Technology--An Assessment (Technical Insights), Evaluation of Critical Development SegmentsSilicon on Insulator--A Key Substrate TechnologyWafer Technologies--An OutlookSOI--A Key Substrate Enabler to 3D ICInterconnects and Bonding Technologies Interconnects and Bonding--A Technology SnapshotTechnology Assesment of TSVsPerformance Evaluation of Via Formation ApproachesPerformance Assessment of Competing Vias Drilling TechniquesTSV Roadblocks to Commercialization3D IC Design Technologies3D IC Design--An OutlookAssessment of Critical Design Segments3D IC Technology--An Assessment (Technical Insights), Industrial Postures on 3D IC AdvancesIndustrial Growth Patterns3D IC--Industrial Growth Objectives3D IC--The Current Scenario3D IC--Key Collaborative ProjectsGrowth Opportunity AnalysisCritical Markers for 3D IC GrowthTechnology Road Map and Key Strategies for Market Penetration3D IC Technology--An Assessment (Technical Insights), Noteworthy Technology Innovation in 3D IC TechnologyPackaging Technologies and Application Specific SolutionsThermal Management Solutions for Next Generation 3D ICElectro Chemical Pattern Replication for Simplefied Manufacturing--SwedenInnovative 3D MEMS Technology--FinlandHigh-Speed Field Solutions for Next Generation IC PackagesInnovative Interconnect Technologies for 3D IC--USAInnovative Design Solutions for 3D ICInterconnect and BondingLooking Beyond TSV for 3D ICDirect Bond Interconnect Technology--USAAdvanced High-Speed Metallic Interconnects3D IC Technology--An Assessment (Technical Insights), Global Patents in 3D IC Technology and Key ContactsPatents in 3D PackagingPatents IPatents IIKey ContactsCorporateAcademic3D IC Technology--An Assessment (Technical Insights), Decision Support DatabaseDecision Support Database TablesElectronic Components Contribution to Electronics Industry--World (2002 to 2012)Semiconductor and Semiconductor Equipment Market--World (2002 to 2012)Manufacturing Enterprises--World (2002 to 2012)Contribution of Manufacturing Industry to GDP--World (2002 to 2012)Number of Service Enterprises--World (2002 to 2012)PCB Sales--World (2002 to 2012)Consumer Electronics Contribution to the Electronics Industry (Percentage)--World (2002 to 2012)

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