3D IC Technology--An Assessment (Technical Insights)

3D IC Technology--An Assessment (Technical Insights)

RELEASE DATE
30-Sep-2008
REGION
North America
Deliverable Type
Technology Research
Research Code: D14C-01-00-00-00
SKU: ES00452-GL-TR_15780
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Description

The research service discusses global trends 3D IC technology. It discusses in detail, development and adoption trends of 3D IC technology focusing on various aspects of the technology across the value chain. It further highlights the new developments in this sector.

Table of Contents

Scope and Methodology

  • Scope
  • Methodology

Research Overview & Key Research Findings

  • Research Overview
  • Key Research Findings

Technology Primer and Applications Scenario

3D IC Technology Performance Evaluation

  • Dominant Packaging Platforms
  • 3D IC--An Industry Outlook
  • Application Scenario

Silicon on Insulator--A Key Substrate Technology

Interconnects and Bonding Technologies

3D IC Design Technologies

  • Wafer Technologies--An Outlook
  • SOI--A Key Substrate Enabler to 3D IC

Packaging Technologies and Application Specific Solutions

Interconnect and Bonding

The research service discusses global trends 3D IC technology. It discusses in detail, development and adoption trends of 3D IC technology focusing on various aspects of the technology across the value chain. It further highlights the new developments in this sector.
More Information
Deliverable Type Technology Research
No Index Yes
Podcast No
Industries Electronics and Sensors
WIP Number D14C-01-00-00-00
Is Prebook No