Adhesives for Medical Applications--Technology Benchmarking and Stakeholder Analysis (Technical Insights)
Adhesives for Medical Applications--Technology Benchmarking and Stakeholder Analysis (Technical Insights)
RELEASE DATE
30-Mar-2010
30-Mar-2010
REGION
Global
Global
Deliverable Type
Technology Research
Technology Research
Research Code: D1F2-01-00-00-00
SKU: CM01122-GL-TR_17896
$4,950.00
In stock
SKU
CM01122-GL-TR_17896
Description
This research service provides a strategic insight into the medical adhesives industry. Starting off with a concise outlook on the technology capability and maturity, the service proceeds to profile the stakeholder and innovator activities with regard to product solutions, regulations, and challenge mitigation. An analysis of the R&D culture and innovation strategies of key stakeholders has also been provided. An analytical piece on the prioritization of five key adhesive technologies preferred for wound care application completes the research study.
Table of Contents
Research Overview
- Medical Adhesives--A Snapshot
- Research Highlights
Scope and Methodology
- Research Scope
- Research Methodology
Technology Snapshot and Trends
Stakeholder Activities and Industry Initiatives
- Technology Capability
- Technology Maturity
Key Stakeholder Analysis
AHP-Based Technology Benchmarking for Wound Care
Patents
Industry Contacts
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Popular Topics
This research service provides a strategic insight into the medical adhesives industry. Starting off with a concise outlook on the technology capability and maturity, the service proceeds to profile the stakeholder and innovator activities with regard to product solutions, regulations, and challenge mitigation. An analysis of the R&D culture and innovation strategies of key stakeholders has also been provided. An analytical piece on the prioritization of five key adhesive technologies preferred for wound care application completes the research study.
Deliverable Type | Technology Research |
---|---|
No Index | Yes |
Podcast | No |
Industries | Chemicals and Materials |
WIP Number | D1F2-01-00-00-00 |
Is Prebook | No |