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Adhesives for wafer-scale bonding is expected to impact the future of next-generation microfluidic devices
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With the boom of the micro-electromechanical systems (MEMS) industry in the last 3 to 5 years, wafer bonding and packaging have become a significant area of interest for the fabrication of the different types of MEMS devices. Among various fabrication techniques, wafer bonding with intermediate adhesives is an important technique as in comparison to other fabrication techniques, adhesive bonding is cost effective, robust, and simple. In adhesive wafer bonding, the adhesive is capable to hold both wafer surfaces together. Adhesive wafer bonding is preferred over other methods because of technical attributes such as insensitivity to surface topography, low bonding temperatures, compatibility with standard integrated circuit wafer processing, and ability to join different types of wafers. This research service provides:a snapshot of various adhesives and capabilities for MEMS wafer fabrication, impact analysis and assessment of recent innovations, a detailed analysis of technology and business accelerators and challenges in adhesives for microfluidic devices, an assessment of technology adoption focusing on the global hotspots and an evaluation of emerging opportunities and adoption roadmap that helps identify the year of impact of various adhesives
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