Adhesives for Microfluidics- Technology Assessment

Adhesives for wafer-scale bonding is expected to impact the future of next-generation microfluidic devices

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With the boom of the micro-electromechanical systems (MEMS) industry in the last 3 to 5 years, wafer bonding and packaging have become a significant area of interest for the fabrication of the different types of MEMS devices. Among various fabrication techniques, wafer bonding with intermediate adhesives is an important technique as in comparison to other fabrication techniques, adhesive bonding is cost effective, robust, and simple. In adhesive wafer bonding, the adhesive is capable to hold both wafer surfaces together. Adhesive wafer bonding is preferred over other methods because of technical attributes such as insensitivity to surface topography, low bonding temperatures, compatibility with standard integrated circuit wafer processing, and ability to join different types of wafers. This research service provides:a snapshot of various adhesives and capabilities for MEMS wafer fabrication, impact analysis and assessment of recent innovations, a detailed analysis of technology and business accelerators and challenges in adhesives for microfluidic devices, an assessment of technology adoption focusing on the global hotspots and an evaluation of emerging opportunities and adoption roadmap that helps identify the year of impact of various adhesives

Table of Contents

1.0 Executive Summary1.1 Research Scope1.2 Research Process and Methodology1.3 Key Findings2.0 Technology Snapshot2.1 Adhesives for wafer-level bonding in microfluidics2.2 Conformal adherence and tailored surface chemistry are key requirements of adhesives2.3 Continuous, droplet, and digital microfluidics continue to remain the key microfluidics2.4 Spin coating is most commonly used for application of adhesives 2.5 Adhesive bonding is still one of the most significant wafer-bonding techniques2.6 MEMS continue to be the most attractive area for adhesive bonding processes2.7 Patterned form of adhesive bonding offers selectivity and localized adhesive application2.8 Steady rise in innovations related to adhesive bonding2.9 Adhesive bonding follows a step-by-step process from surface cleaning to final bonding2.10 Epoxy and silicones are key materials preferred for wafer-scale bonding2.11 PDMS and silicones offer very high opportunities to demonstrate durability and high adhesion2.12 Use of silicones as adhesives can reduce the non-bonded area2.13 Healthcare and pharmaceuticals will have highest potential for microfluidics in short term2.14 Chemicals and personal care are considered emerging areas for microfluidics2.15 MEMS and optoelectronics are considered most attractive segments for wafer bonding process3.0 Impact Assessment of Adhesives for Microfluidics3.1 Growing healthcare market is the main driver for adhesives in microfluidics3.2 Foundries and original equipment manufacturers (OEM) are the key decision makers in the microfluidics value chain3.3 North American and European end-user companies are keen to partner with Asia-Pacific foundries4.0 Innovation Ecosystem4.1 Widespread research activity across the innovation ecosystem4.2 Adhesive innovations in the pharmaceutical industry4.3 Adhesive innovations for diagnostic applications4.4 Adhesive innovations for other application industries4.5 Key microfluidic device innovations in the pharmaceutical industry4.6 Key microfluidic device innovations for clinical diagnostics4.7 Key microfluidic device innovations for point of care diagnostics5.0 Technology Development and Adoption Trends5.1 Ease of bonding and good self-healing properties are two primary focus areas in terms of R&D5.2 USPTO finds the highest number of patent applications in the microfluidics space5.3 Silicone adhesives are prominent in patent filings in 20155.4 Epoxy adhesives find the highest number of patent filings in the last few years in wafer-scale bonding5.5 Adhesives for microfluidics gaining research interest across the globe5.6 Pharmaceutical, drug delivery, diagnostics, assays, and optics are some of the highly emerging areas for microfluidics5.7 LOC devices and diagnostics represent key opportunities for adhesive development5.8 Increasing R&D focusing on adhesives for microfluidics facilitates new product development5.9 R&D initiatives are focused toward development of newer adhesive and bonding technologies to develop better designed MEMS and ICs6.0 Opportunity Evaluation6.1 Healthcare is the most significant industry for adhesives in the microfluidics space6.2 Microfluidic technologies in the chemicals and food industry are still in the R&D phase6.3 Microfluidics will grow exponentially in the electronics industry 6.4 Microfluidics will have high potential in the biotechnology and energy industries in the mid term6.5 Opportunities for adhesives in wafer bonding for the electronics sector6.6 Opportunities for adhesives for wafer bonding in the healthcare sector7.0 Growth Opportunities7.1 Growth opportunity : microfluidics in the healthcare space — new capabilities7.2 Growth opportunity : microfluidics in the healthcare space — geographic expansion7.3 Growth opportunity : microfluidics in the life sciences applications — vertical markets7.4 Growth opportunity : microfluidics in the life sciences applications —new capabilities7.5 Growth opportunity : microfluidics in electronics — disruptive applications7.6 Growth opportunity: microfluidics in electronics — value-add services7.7 Strategic imperatives for success and growth 8.0 Key Patents8.1 Key Patents8.1 Key Patents (continued)8.1 Key Patents (continued)9.0 Key Contacts9.1 Key Contacts9.1 Key Contacts (continued)Legal Disclaimer10.0 Appendix10.1 Ratings of OSE Matrix10.2 Final Ratings of OSE11.0 The Frost & Sullivan Story11.1 The Frost & Sullivan Story11.2 Value Proposition: Future of Your Company & Career11.3 Global Perspective11.4 Industry Convergence11.5 360º Research Perspective11.6 Implementation Excellence11.7 Our Blue Ocean Strategy




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