Advancements in Micro-supercapacitors, Virtual Retinal Displays, Bone Conduction, and Radio Frequency

Advancements in Micro-supercapacitors, Virtual Retinal Displays, Bone Conduction, and Radio Frequency

RELEASE DATE
22-Jun-2018
REGION
Global
Research Code: D777-00-8B-00-00
SKU: ES01036-GL-TA_22113

$250.00

Special Price $187.50 save 25 %

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SKU
ES01036-GL-TA_22113

$250.00

$187.50 save 25 %

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Description

This Microelectronics TOE profiles developments in micro-supercapacitors, virtual retinal displays, bone conduction, and radio frequency. Innovations include a novel fabrication technology for micro-supercapacitors, virtual retinal display speeds modeling, a bone conduction wireless earphone, helping special forces hear secretly, and reducing power and increasing throughput in electronic warfare.

The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Keywords: Micro-supercapacitor, displays, virtual retinal displays, bone conduction, radio frequency, RF, fabrication

Table of Contents

Innovations in Micro-supercapacitors, Virtual Retinal Displays, Bone Conduction, and Radio Frequency

  • Novel Fabrication Technology for Micro-supercapacitors
  • Virtual Retinal Display Speeds Modeling
  • Bone Conduction Wireless Earphone
  • Helping Special Forces Hear Secretly
  • Reducing Power and Increasing Throughput in Electronic Warfare
  • Industry Contacts
Related Research
This Microelectronics TOE profiles developments in micro-supercapacitors, virtual retinal displays, bone conduction, and radio frequency. Innovations include a novel fabrication technology for micro-supercapacitors, virtual retinal display speeds modeling, a bone conduction wireless earphone, helping special forces hear secretly, and reducing power and increasing throughput in electronic warfare. The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: Micro-supercapacitor, displays, virtual retinal displays, bone conduction, radio frequency, RF, fabrication
More Information
No Index No
Podcast No
Industries Electronics and Sensors
WIP Number D777-00-8B-00-00
Is Prebook No
Ti Codes D773,D900,D901,D904,D909,D90A,D90D,D90E,D911,D913,D914,D915,D917,D918,D91B,D91C,D920,D922,D924,D925,D928,D930,D934,D941,D943,D944,D947-TI