Advances in Materials for Electronic Packaging (Technical Insights)

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This research service profiles important emerging developments and trends related to materials for electronic packaging.

Table of Contents

Advances in Materials for Electronic Packaging (Technical Insights), Executive SummaryScope and MethodologyScopeMethodologyKey Research FindingsDescription of Key Drivers and ChallengesResearch HighlightsAdvances in Materials for Electronic Packaging (Technical Insights), Materials for Electronic PackagingMaterials Application--Part IOverviewMaterials for High-Frequency ApplicationsSoldering MaterialsThrough Silicon ViasElectrically Conductive AdhesivesMaterial Application--Part IISubstrate MaterialsLow and Ultralow-k MaterialsWirebondingOverviewChallenge Associated with Tin WhiskersFlip Chip Technology--C4 (Controlled Collapse Chip Connection)OverviewFlip Chip BumpsFlip Chip CNTs BumpsUnder Bump MetallizationUnderfillMolding MaterialsThermal Managment MaterialsIntroductionAlSiCThermal Interface Materials Phase Change MaterialsMaterials for Specific Cooling Systems CopperDiamondBoron NitrideAluminum NitrideAdvances in Materials for Electronic Packaging (Technical Insights), Assessment of Industry and Supply ChainIndustry AnalysisIndustry Drivers and ChallengesMedical Electronic Packaging TrendsAutomotive Electronic Packaging TrendsRoadmap for Electronic Packaging MaterialsSupply Chain AnalysisOverviewEfforts of ProducersRole of Customers and NGOsAdvances in Materials for Electronic Packaging (Technical Insights), The Regulatory ScenarioFlame Retardant MaterialsIntroductionBrominated Flame RetardantsPolybrominated Diphenyl EthersEuropean Union RegulationsIntroductionRoHS Directive Waste Electrical and Electronic Equipment Directive Registration Evaluation Authorization and Restriction of ChemicalsOther Regulations and Impact of Eco-LabelingUSA RegulationsAsian RegulationsImpact of Eco-LabelingAdvances in Materials for Electronic Packaging (Technical Insights), Global Advancements in R&D of Materials Used for Electronic PackagingCorporationsHighly Reliable Systems from C-MacThermal Management Materials from CPS TechnologiesIntegrated Module Board Solution from ImberaIntel Advances in the Area of Packaging MaterialsElectronic Packaging for Harsh EnvironmentInteresting Material for Thermal ManagementApplication of Current Packaging Equipment for New Packaging MaterialsAdvances of Packaging Materials from Rohm & HassElectronic Packaging Solutions from TesseraLatest Developments in Packaging from Texas InstrumentsApplication of A Diamond in A PackageElectromagnetic Band Gap Technology for Noise SuppressionNew Material Solution for Printed ElectronicsUniversities and Research CentersHot Wire Chemical Vapor Deposition of CopperNew Innovative Materials from Fraunhoffer InstituteInteresting Materials for Electronic Packaging from Georgia TechPromising Nanomaterials for Electronic Packaging Potential Solution for High-Heat Flux Rates in PackagesPromising Organic Material for Electronic ApplicationsNew Nanomaterials Embedded in Package StructureAdvances in Materials for Electronic Packaging (Technical Insights), Patents and Database of Key Industry and Academic PartnersNoteworthy Patents; Patents Analysis; and GlossaryNoteworthy Patents--Part INoteworthy Patents--Part IIGlossaryDatabase of Key PartnersCorporationsResearch Institutions and UniversitiesAdvances in Materials for Electronic Packaging (Technical Insights), Decision Support DatabaseReference Database TablesElectronic Components Contribution to Electronics Industry--World (2002 to 2012)Semiconductor and Semiconductor Equipment Market--World (2002 to 2012)Consumer Electronics Contribution to the Electronics Industry (Percentage)--World (2002 to 2012)Total PC Installed Base (2002 to 2012)PCB Sales--World (2002 to 2012)

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