Analysis of the Asia-Pacific 3-D IC Market

The Global Manufacturing Hub and the Second Home for 3-D IC Research Development

  • Research Code : 4I73-01-00-00-00
  • SKU : ES00023-AP-MR_02408
  • Share this :
  • Release Date : 13-May-2013
  • Region : Asia Pacific
  • Request Study Sample

Availability: In stock

This research service provides an in-depth analysis of the Asia-Pacific 3D IC market. The Asia-Pacific market for 3-D IC includes Japan, Korea, China, and Taiwan. Japan hosts some of the biggest semiconductor participants in the world. The study covers the 3D packaging and TSV (Through Silicon Via) segments of the market. Analysis included covers the various drivers, restraints and challenges that affect the market in each of these regions, identified by Frost & Sullivan through its elaborate Market Research Methodology. In addition, the study discusses the revenue forecast analysis from 2009 to 2019 for the Asia-Pacific market and offers strategic recommendations.
USD 4,950

* Required Fields

Pay By Invoice

Be the first to review this product

Related Research

1. Primary Research

Our analysis is based on comprehensive primary research conducted with core market participants.

2. Global Coverage

Unparalleled coverage of geographies, our analyst & consultant teams are based in 42+ offices spanning the globe.

3. Breadth of Vertical Industries

We cover the broadest spectrum of markets to provide our clients with the most relevant analysis and transformational insights.

4. Visionary Innovation Research

With on-going transformational shifts, our visionary innovation research prepares you with information on key megatrends shaping the future of your industry.

5. Mega Trends

Mega Trends are global forces that transform business, societies and economies.

6. Convergence Research Coverage

Taking an approach of analysing a macro-to-micro impact, our convergence research helps you prepare against an impending 'Kodak moment'.