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Analysis of the Asia-Pacific 3-D IC Market

The Global Manufacturing Hub and the Second Home for 3-D IC Research Development

  • Research Code : 4I73-01-00-00-00
  • SKU : ES00023-AP-MR_02408
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  • Release Date : 13-May-2013
  • Region : Asia Pacific
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This research service provides an in-depth analysis of the Asia-Pacific 3D IC market. The Asia-Pacific market for 3-D IC includes Japan, Korea, China, and Taiwan. Japan hosts some of the biggest semiconductor participants in the world. The study covers the 3D packaging and TSV (Through Silicon Via) segments of the market. Analysis included covers the various drivers, restraints and challenges that affect the market in each of these regions, identified by Frost & Sullivan through its elaborate Market Research Methodology. In addition, the study discusses the revenue forecast analysis from 2009 to 2019 for the Asia-Pacific market and offers strategic recommendations.
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