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Analysis of the Global 3-D IC Market
Analysis of the Global 3-D IC Market
Stacked Memories and Logic SOC to Drive the Future 3-D IC Market
13-May-2013
Global
Description
This research service provides an in-depth analysis of the global 3D IC market. Nearly ten years ago, 3-dimensional integrated circuit (3-D IC) technology emerged, starting with 3-D packaging in 2000. The study covers the 3D packaging and TSV (Through Silicon Via) segments. It analyzes the market geographically as follows: Global (total market), North America, Europe, and Asia-Pacific. The study discusses the various market drivers and market restraints that impact each of these regions, as identified by Frost & Sullivan through its elaborate Market Research Methodology. Finally, this research provides a competitive analysis, Mega Trends and their impact, and it concludes by offering strategic recommendations.
Table of Contents
Executive Summary
Executive Summary—Market Engineering Measurements
Executive Summary—Market Engineering Measurements (continued)
Executive Summary—CEO’s Perspective
Market Overview—Definitions
Market Overview—Definitions (continued)
Market Overview—Definitions (continued)
Market Overview—Definitions (continued)
Market Overview—Definitions (continued)
Market Definition—Scope
Market Overview—Key Questions This Study Will Answer
Market Overview—Distribution Channels
Drivers and Restraints
Drivers Explained
Drivers Explained (continued)
Drivers Explained (continued)
Restraints Explained
Restraints Explained (continued)
Restraints Explained (continued)
Market Engineering Measurements
Market Engineering Measurements (continued)
Forecast Assumptions
Total 3-D IC Market—Revenue Forecast
Revenue Forecast Discussion
3-D Packaging Segment—Revenue Forecast
3-D TSV Segment—Revenue Forecast
Revenue Forecast Discussion
Total 3-D IC Market—Percent Revenue Forecast by Region
Revenue Forecast by Region
Revenue Forecast Discussion
Competitive Environment
Some of the Major Market Participants
Some of the Major Market Participants (continued)
Market Overview—Impact of 3-D IC Industry Mega Trends on the Electronics Market
The Last Word—Three Big Predictions
Legal Disclaimer
Market Engineering Methodology
Others
Learn More—Next Steps
| No Index | Yes |
|---|---|
| Podcast | No |
| Author | Priya Venkatraman |
| Industries | Electronics and Sensors |
| WIP Number | NBFE-01-00-00-00 |
| Is Prebook | No |