Analysis of the Global 3-D IC Market

Stacked Memories and Logic SOC to Drive the Future 3-D IC Market

  • Research Code : NBFE-01-00-00-00
  • SKU : ES00066-GL-MR_02500
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  • Release Date : 13-May-2013
  • Region : Global
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This research service provides an in-depth analysis of the global 3D IC market. Nearly ten years ago, 3-dimensional integrated circuit (3-D IC) technology emerged, starting with 3-D packaging in 2000. The study covers the 3D packaging and TSV (Through Silicon Via) segments. It analyzes the market geographically as follows: Global (total market), North America, Europe, and Asia-Pacific. The study discusses the various market drivers and market restraints that impact each of these regions, as identified by Frost & Sullivan through its elaborate Market Research Methodology. Finally, this research provides a competitive analysis, Mega Trends and their impact, and it concludes by offering strategic recommendations.

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1. Primary Research

Our analysis is based on comprehensive primary research conducted with core market participants.

2. Global Coverage

Unparalleled coverage of geographies, our analyst & consultant teams are based in 42+ offices spanning the globe.

3. Breadth of Vertical Industries

We cover the broadest spectrum of markets to provide our clients with the most relevant analysis and transformational insights.

4. Visionary Innovation Research

With on-going transformational shifts, our visionary innovation research prepares you with information on key megatrends shaping the future of your industry.

5. Mega Trends

Mega Trends are global forces that transform business, societies and economies.

6. Convergence Research Coverage

Taking an approach of analysing a macro-to-micro impact, our convergence research helps you prepare against an impending 'Kodak moment'.