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Analysis of the North American 3-D IC Market

The Global Think Tank and Research Center for 3-D IC Development

  • Research Code : 4I71-01-00-00-00
  • SKU : ES00021-NA-MR_02406
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  • Release Date : 13-May-2013
  • Region : North America
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North America, home of Silicon Valley, has been the research center for semiconductor research and development for many years now. This research service provides an in-depth analysis of the North American 3D IC market. It covers the 3D packaging and TSV (Through Silicon Via) segments. The study discusses the various drivers, restraints and challenges that affect the market in each of these regions, identified by Frost & Sullivan through its elaborate Market Research Methodology. Finally, the study discusses the revenue forecast analysis from 2009 to 2019 for the North American market. The North American region for 3-D IC includes the United States and Canada as the major markets.
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