Asia Pacific Smart Cards Market - Integrated Circuit on Different Form Factors
Asia Pacific Smart Cards Market - Integrated Circuit on Different Form Factors
RELEASE DATE
27-Aug-2010
27-Aug-2010
REGION
Asia Pacific
Asia Pacific
Research Code: P311-01-00-00-00
SKU: IT02281-EU-MR_12036
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SKU
IT02281-EU-MR_12036
Description
This study takes an in depth look at the smart cards market in Asia Pacific with regards to the different forms that have been and will potentially be deployed. Common form factors such as the standard plastic card and SIM cards have been widely accepted. Other form factors such as booklets, typically used in e-Passports (passport booklets with Smart Card integrated circuits embedded within) as well as coin-like tokens have been well received in their respective niche markets. This study also highlights several common trends as well as strategic recommendations for up and coming form factors that carry smart card technology.
Table of Contents
APAC Smart Cards Integrated Circuit on Different Form Factors
- APAC Smart Cards IC on Different Form Factors
Popular Topics
This study takes an in depth look at the smart cards market in Asia Pacific with regards to the different forms that have been and will potentially be deployed. Common form factors such as the standard plastic card and SIM cards have been widely accepted. Other form factors such as booklets, typically used in e-Passports (passport booklets with Smart Card integrated circuits embedded within) as well as coin-like tokens have been well received in their respective niche markets. This study also highlights several common trends as well as strategic recommendations for up and coming form factors that carry smart card technology.
No Index | Yes |
---|---|
Podcast | No |
Industries | Information Technology |
WIP Number | P311-01-00-00-00 |
Is Prebook | No |