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Global Advances in Electronic/Chip Packaging (Technical Insights)
Global Advances in Electronic/Chip Packaging (Technical Insights)
RELEASE DATE
31-Dec-2007
31-Dec-2007
REGION
Research Code: D0C1-01-00-00-00
SKU: ES00442-GL-TR_15770
$4,950.00
In stock
SKU
ES00442-GL-TR_15770
Description
The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.
Table of Contents
Scope and Methodology
- Scope
- Methodology
Research Overview and Key Findings
- Research Overview
- Key Findings
Technology Evolution in the Silicon IC Industry
Advanced Chip Packaging -- Technology Primer
- Introduction to Chip Packaging Technologies
- Growth Patterns in the Silicon IC Industry
Adoption Factors for the Chip Packaging Industry
- System in Package (SiP)
- System on Chip (SoC)
- Stacked Die Packages
- Stacked Packages
- Multi-Chip Module (MCM)
- SoC versus SiP
Wafer and Surface Mount Technologies
Interconnect Technologies and Signal Integrity
Technology Trends
3D Integration Industry Trends; Analyst Insights
Innovative Chip and Board Packaging Technologies--World
Signal Integrity and IP Developments--World
Key Patents Related to this Sector
Key Contacts
Decision Support Database Tables
Popular Topics
The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.
| No Index | Yes |
|---|---|
| Podcast | No |
| Industries | Electronics and Sensors |
| WIP Number | D0C1-01-00-00-00 |
| Is Prebook | No |