World Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights)

World Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights)

RELEASE DATE
29-Sep-2004
REGION
Global
Research Code: D303-01-00-00-00
SKU: TE02050-NA-SF_13680
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Description

A detailed assessment of research and development in the field of Electronic Packaging

Table of Contents

Overview; Highlights; and Key Findings

  • Electronic Packaging--An Analysis
  • Highlights and Key Findings

Scope and Methodology

  • Scope of the Research Service
  • Methodology

Packaging --Primer on Technologies

Existing Technologies--An Analysis

  • Technology Snapshot
  • Technology Requirements
  • Growth Drivers and Technology Challenges

Stacked-Die Packages--An Analysis

Global Technology Developments--Stacked-Die Packages

Global Technology Developments--Thermal Management

  • Technology Description
  • SiP Approach in Stacked-Die Packages
  • Technology Drivers and Challenges

Package Architecture; Materials; Interconnect Technologies

Global Technology Developments --- Interconnect Technologies

Global Technology Developments in Packaging Materials--Universities; R&D Labs

Related Research
A detailed assessment of research and development in the field of Electronic Packaging
More Information
No Index Yes
Podcast No
Industries Telecom
WIP Number D303-01-00-00-00
Is Prebook No