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Analysis of the European 3-D IC Market
Analysis of the European 3-D IC Market
Gearing up to Take its Place in the Global Semiconductor Ecosystem
RELEASE DATE
13-May-2013
13-May-2013
REGION
Europe
Europe
Research Code: 4I72-01-00-00-00
SKU: ES00022-EU-MR_02407
$4,950.00
In stock
SKU
ES00022-EU-MR_02407
Description
European companies represent about 13.0% of the world semiconductor production and have been a major importer of electronic components. The key focus in Europe so far has been the automotive sector. This research service provides an in-depth analysis of the European 3D IC market. The study covers the 3D packaging and TSV (Through Silicon Via) segments. The study discusses the various drivers, restraints and challenges that affect the market in each of these regions, identified by Frost & Sullivan through its elaborate Market Research Methodology. Apart from this, the study also discusses the revenue forecast analysis from 2009 to 2019 for the European market.
Table of Contents
Executive Summary
Executive Summary—Market Engineering Measurements
Executive Summary—Market Engineering Measurements (continued)
Executive Summary—CEO’s Perspective
Market Overview—Definitions
Market Overview—Definitions (continued)
Market Overview—Definitions (continued)
Market Overview—Definitions (continued)
Market Definition—Scope
Market Overview—Key Questions this Study will Answer
Market Overview—Distribution Channels
Drivers and Restraints
Drivers Explained
Drivers Explained (continued)
Restraints Explained
Restraints Explained (continued)
Market Engineering Measurements
Market Engineering Measurements (continued)
Forecast Assumptions
3-D IC Market—Revenue Forecast
Revenue Forecast Discussion
3-D Packaging Segment—Revenue Forecast
3-D TSV Segment—Revenue Forecast
Revenue Forecast Discussion
The Last Word—Three Big Predictions
Legal Disclaimer
Market Engineering Methodology
Learn More—Next Steps
Popular Topics
European companies represent about 13.0% of the world semiconductor production and have been a major importer of electronic components. The key focus in Europe so far has been the automotive sector. This research service provides an in-depth analysis of the European 3D IC market. The study covers the 3D packaging and TSV (Through Silicon Via) segments. The study discusses the various drivers, restraints and challenges that affect the market in each of these regions, identified by Frost & Sullivan through its elaborate Market Research Methodology. Apart from this, the study also discusses the revenue forecast analysis from 2009 to 2019 for the European market.
| No Index | Yes |
|---|---|
| Podcast | No |
| Author | Priya Venkatraman |
| Industries | Electronics and Sensors |
| WIP Number | 4I72-01-00-00-00 |
| Is Prebook | No |