Scope and Methodology

• Scope
• Methodology

Key Research Findings

• Description of Key Drivers and Challenges
• Research Highlights

Materials Application--Part I

Material Application--Part II

• Overview
• Materials for High-Frequency Applications
• Soldering Materials
• Through Silicon Vias
• Electrically Conductive Adhesives

Wirebonding

• Substrate Materials
• Low and Ultralow-k Materials

Flip Chip Technology--C4 (Controlled Collapse Chip Connection)

• Overview
• Challenge Associated with Tin Whiskers

Thermal Managment Materials

• Overview
• Flip Chip Bumps
• Flip Chip CNTs Bumps
• Under Bump Metallization
• Underfill
• Molding Materials

Industry Analysis

Supply Chain Analysis

Flame Retardant Materials

European Union Regulations

Other Regulations and Impact of Eco-Labeling

Corporations

Universities and Research Centers

Noteworthy Patents; Patents Analysis; and Glossary

Database of Key Partners

Reference Database Tables