World Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights)
World Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights)
RELEASE DATE
29-Sep-2004
29-Sep-2004
REGION
Global
Global
Research Code: D303-01-00-00-00
SKU: TE02050-NA-SF_13680
$3,950.00
Special Price $2,962.50 save 25 %
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SKU
TE02050-NA-SF_13680
Description
A detailed assessment of research and development in the field of Electronic Packaging
Table of Contents
Overview; Highlights; and Key Findings
- Electronic Packaging--An Analysis
- Highlights and Key Findings
Scope and Methodology
- Scope of the Research Service
- Methodology
Packaging --Primer on Technologies
Existing Technologies--An Analysis
- Technology Snapshot
- Technology Requirements
- Growth Drivers and Technology Challenges
Stacked-Die Packages--An Analysis
Global Technology Developments--Stacked-Die Packages
Global Technology Developments--Thermal Management
- Technology Description
- SiP Approach in Stacked-Die Packages
- Technology Drivers and Challenges
Stacked Packages -- An Analysis
Global Technology Developments
Technology Description
Global Technology Developments
Package Architecture; Materials; Interconnect Technologies
Global Technology Developments --- Interconnect Technologies
Global Technology Developments in Packaging Materials--Universities; R&D Labs
Future Trends in the Industry
Packaging Consortiums; Mergers; Acquisitions
Patents
Contact Details
Technology Innovation
Excellence in Technology
Decision Support Database Tables related to Electronic Packaging
Popular Topics
A detailed assessment of research and development in the field of Electronic Packaging
No Index | Yes |
---|---|
Podcast | No |
Industries | Telecom |
WIP Number | D303-01-00-00-00 |
Is Prebook | No |