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Impact of 3D IC in the Electronics Industry (Technical Insights)
Impact of 3D IC in the Electronics Industry (Technical Insights)
RELEASE DATE
30-Dec-2010
30-Dec-2010
REGION
Research Code: D28C-01-00-00-00
SKU: ES00492-GL-TR_15820
$4,950.00
Special Price $3,712.50 save 25 %
In stock
SKU
ES00492-GL-TR_15820
Description
This report discusses the 3D IC integration technology and its impact on electronics industry. The research and development in 3D IC integration area is driven by the need for more sophisticated and more efficient devices. A variety of 3D IC technology implementation choices, including 3D packaging, wafer-level packaging and 3D on chip, are studied with regard to factors such as cost of implementation, performance, efficiency, potential market and available infrastructure.
Table of Contents
Scope and Methodology
- Scope
- Research Methodology
Overview and Research Highlights
- Overview
- Key Research Highlights
3D Packaging Integration Technology
Wafer Level Packaging
- Technology Overview
- Key Trends
3D On Chip Technology
- Technology Overview and Trends
- TSV Technology and Trends
- TSV Fabrication
- Bonding and Microbump Technology and Trends
- Interposer Technology and Trends
Impact Assessment of 3D IC Technology
Potential Applications
Impact of Drivers and Challenges
Emerging Opportunities - 3D IC Technology
Roadmapping and Technology Management Strategies
Patents
Key Contacts
Popular Topics
This report discusses the 3D IC integration technology and its impact on electronics industry. The research and development in 3D IC integration area is driven by the need for more sophisticated and more efficient devices. A variety of 3D IC technology implementation choices, including 3D packaging, wafer-level packaging and 3D on chip, are studied with regard to factors such as cost of implementation, performance, efficiency, potential market and available infrastructure.
| No Index | Yes |
|---|---|
| Podcast | No |
| Industries | Electronics and Sensors |
| WIP Number | D28C-01-00-00-00 |
| Is Prebook | No |