Scope and Methodology

• Scope
• Research Methodology

Key Findings

• Where is the Back-End Semiconductor Industry Headed
• Noteworthy Applications

Wafer Bumping Technology Impact Analysis

Next-Generation Electronic Packaging and Interconnect Technology Impact Analysis

• Wafer Bumping--Technology Primer
• The Road to Lead-Free Wafer Bumping
• Lead-Free Materials
• Competing Technologies
• Wafer Bumping Applications Viewpoint
• Industry Trends in Lead-Free Wafer Bumping

Lead-Free Wafer Bumping Technology--Drivers and Challenges

Electronic Packaging and Interconnect Technology--Drivers and Challenges

Wafer Bumping--Global Innovative Developments

Chip Packaging - Global Innovative Developments

Other Back-End Technologies--Global Innovative Developments

Key Patents

Database of Key Industry Participants

Frost & Sullivan Award for Technology Innovation

Frost & Sullivan Award for Excellence in Technology

Frost & Sullivan Award for Excellence in Research

Frost & Sullivan Award for Product Leadership

Frost & Sullivan Award for Technology Leadership

Decision Support Database Tables