Emerging Technology Developments in Chip/Board Level Interconnects (Technical Insights)

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A detailed assessment of the emerging technology developments in the field of Interconnects at the chip/board level.

Table of Contents

Emerging Technology Developments in Chip/Board Level Interconnects (Technical Insights), Executive SummaryScope and MethodologyScope of the Research ServiceMethodologyKey FindingsOptical Technologies--Simply Unwired but ConnectedNoteworthy ApplicationsGlobal ScenarioEmerging Technology Developments in Chip/Board Level Interconnects (Technical Insights), Technology and Applications ViewpointInterconnect Technology--Industry Impact AnalysisOn-Chip Optical Interconnects--Photons Replace Electrons for InterconnectsBoard Level ConnectorsChip-to-Package InterconnectsCurrent Landscape of Competing TechnologiesApplications SpectrumIndustry TrendsFuture Trends--Choosing the Right SolutionGrowth Outlook--Technology RoadmapEmerging Technology Developments in Chip/Board Level Interconnects (Technical Insights), Technology Adoption Factor AnalysisTechnology Drivers and Challenges--Chip Level InterconnectsOn-Chip Interconnect Technology--Growth DriversOn-Chip Interconnects--Technology ChallengesTechnology Drivers and Challenges--Board Level ConnectorsBoard Level Connectors--Growth DriversBoard Level Connectors--Technology ChallengesEmerging Technology Developments in Chip/Board Level Interconnects (Technical Insights), Assessment of Global Innovation and OpportunitiesThe Innovation Frontier--Technology Developments in North America Low Cost/High Speed Digital Technology for Short Range InterconnectionsAttach Method for Backplane ConnectorsOn-Chip Optical Interconnects for Next-Generation MicroprocessorsHybrid Device Paves Way for On-Chip Optical Interconnection3D Interconnect Technology for Next-Generation Semiconductors3D Chips Enable High Speed InterconnectsOptical Technology Takes a Next Step toward RealityNext-Generation Connectors To Enable 100 Gbps Data Transmission3D IC Technology Comes to the Rescue of Next-Generation InterconnectsThe Innovation Frontier -- Technology Developments in Europe and AsiaSurface Mount Techniques in Backplane Connectors Enable High-Speed Data Transmission-- GermanyStrategic Partnership To Develop On-Chip Interconnects for Sub-45 nm Designs-- Netherlands/BelgiumFlip-Chip Interconnect Technology Enables 3D Chip Integration-- GermanyOn-Chip Interconnect Technology for Next-Generation Memory Products--TaiwanInterconnect Research Leads to Flip Chip Improvements--FinlandInterconnect Solution on Si-Ge Technology Facilitates High Frequency Applications--GermanyWafer Interconnections for Electronic Devices-- NetherlandsPolymer-Based Interconnects Likely to Enable Next-Generation Electronic Products-- FranceEmerging Technology Developments in Chip/Board Level Interconnects (Technical Insights), Patent Analysis and Database of Key Industry ParticipantsPatent Analysis/Upcoming Conferences and WorkshopsAssessment of Patents in Back-end Semiconductor SectorKey Patents Related to Interconnect TechnologyUpcoming Conferences and WorkshopsDatabase of Key Industry ParticipantsCorporatesUniversities/Research LabsEmerging Technology Developments in Chip/Board Level Interconnects (Technical Insights), Frost & Sullivan 2005 Science and Technology AwardsProduct Innovation AwardAward DescriptionAward RecipientExcellence in Technology AwardAward DescriptionAward RecipientEmerging Technology Developments in Chip/Board Level Interconnects (Technical Insights), Critical Reference Tables Decision Support Database TablesGlobal Semiconductor and Semiconductor Equipment Market (1999-2006)Global Cellular Handsets Installed Base (1999-2006)Number of Manufacturing Establishments in North America (1999-2006)Total Portable PC Installed Base (1999-2006)Unit Shipment of PDAs--North America (1999-2009)Unit Shipment of Digital Cameras--North America (1999-2009)




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