GROWTH OPPORTUNITIES IN DATA STORAGE, WIRELESS CHARGING, MICROLED, SYSTEM-ON-CHIP, AND GALLIUM ELECTRONICS

GROWTH OPPORTUNITIES IN DATA STORAGE, WIRELESS CHARGING, MICROLED, SYSTEM-ON-CHIP, AND GALLIUM ELECTRONICS

RELEASE DATE
12-Nov-2021
REGION
Global
Research Code: D777-00-C8-00-00
SKU: CI00788-GL-TA_26013
$950.00
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CI00788-GL-TA_26013
$950.00
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Description

The Microelectronics Technology Opportunity Engine for November 2021 covers innovations related to data storage, system-on-chip, gallium electronics, and wireless charging. Some of the key innovations profiled include non-volatile memory express card for data centers, data processing units, wireless charging of consumer electronics, NFC wireless charging, microLED display, and carbon nanotube-based 3D system-on-chip.

The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Keywords: Data storage, memory, NVME, non-volatile memory express, data processing, wireless charging, NFC, Near Field Communication, microLED, carbon nanotube, SoC, system-on-chip, gallium electronics, compound semiconductor, terahertz

Table of Contents

INNOVATIONS IN MICROELECTRONICS

  • DATA PROCESSING UNIT DELIVERS HIGH EFFICIENCY
  • VALUE PROPOSITION OF FUNGIBLE
  • FUNGIBLE—INVESTOR DASHBOARD
  • NON-VOLATILE MEMORY EXPRESS CARD ENABLES SUPERIOR PERFORMANCE IN DATA CENTERS
  • VALUE PROPOSITION OF GRAID TECHNOLOGY
  • GRAID TECHNOLOGY—INVESTOR DASHBOARD
  • NOVEL WIRELESS CHARGING TECHNOLOGY FOR CONSUMER ELECTRONICS
  • FLI CHARGE’S VALUE PROPOSITION IS SUPERFAST AND MULTI-DEVICE CHARGING SOLUTIONS
  • FLI CHARGE–INVESTOR DASHBOARD
  • NOVEL ARM-BASED SERVER PROCESSOR FOR DATA CENTERS
  • VALUE PROPOSITION OF AMPERE COMPUTING—ENERGY-EFFICIENT PRODUCT DESIGN
  • AMPERE COMPUTING—INVESTOR DASHBOARD
  • NOVEL NFC WIRELESS CHARGING TECHNOLOGY FOR SPACE-CONSTRAINED DEVICES
  • VALUE PROPOSITION OF NUCURRENT—CUSTOMIZED NFC WIRELESS CHARGING SOLUTION TO UNIQUE BUSINESS PROBLEMS
  • NUCURRENT—INVESTOR DASHBOARD
  • NOVEL MICRO LIGHT-EMITTING DIODE-BASED DISPLAY
  • CARBON NANOTUBE-BASED 3DSOC TECHNOLOGY
  • NOVEL GALLIUM NITRIDE MATERIAL-BASED MICRODISPLAY
  • SEMICONDUCTOR WITH MICROCAVITY CAUSES LOW ENERGY DISSIPATION
  • TERAHERTZ EMITTING EQUIPMENT ASSESSES INSULATOR EFFICIENCY

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Related Research
The Microelectronics Technology Opportunity Engine for November 2021 covers innovations related to data storage, system-on-chip, gallium electronics, and wireless charging. Some of the key innovations profiled include non-volatile memory express card for data centers, data processing units, wireless charging of consumer electronics, NFC wireless charging, microLED display, and carbon nanotube-based 3D system-on-chip. The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Keywords: Data storage, memory, NVME, non-volatile memory express, data processing, wireless charging, NFC, Near Field Communication, microLED, carbon nanotube, SoC, system-on-chip, gallium electronics, compound semiconductor, terahertz
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WIP Number D777-00-C8-00-00
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