Growth Opportunities in Semiconductors for 6G Wireless Technology

Electronics and SensorsGrowth Opportunities in Semiconductors for 6G Wireless Technology

AI Chipsets and Compound Semiconductors Will Play a Transformational Role, Enabling the Operational and Economic Targets of Next-gen Cellular Wireless Technology

RELEASE DATE
26-Jul-2024
REGION
Global
Deliverable Type
Market Research
Research Code: K979-01-00-00-00
SKU: ES_2024_886
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Growth Opportunities in Semiconductors for 6G Wireless Technology
Published on: 26-Jul-2024 | SKU: ES_2024_886

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Wireless communication systems rely on semiconductor components, such as PAs, LNAs, and transceivers (together known as RF FEMs), to process signals to and from the radio unit (RU), baseband unit (BBU), and the network core to ensure customers receive the radio signals that carry the data and services.

The communication system relies on other semiconductor components, such as antenna integrated circuits (ICs), envelope trackers, microprocessors, analog devices, and optical components, to process signals as necessary. The type of semiconductors that wireless telecom communication uses has not changed much with the 2G to 5G evolution of technologies. However, the semiconductor components’ performance requirements have increased. Hence, the designs, materials, manufacturing, and packaging technologies have evolved with each new wireless communication generation.

Because 5G wireless technology is in the deployment stage, industry leaders have begun discussions about developing the next-gen wireless technology (6G) and plan to begin early commercialization in 2030. The dawn of 6G will represent a new era of communication that will provide new services beyond data. The study discusses distributed and federated learning at the edge, co-inferencing between edge and core, autonomous functioning of end devices, the development of AI-powered human-centric telecom services, joint communication, computing, sensing, and control, and several other concepts, which represent a transformation from radio access network (RAN) architecture to services.

To develop 6G, industry stakeholders are collaborating to plan the components and building blocks of each sub-technology that will lead to the development of the next-gen wireless technology. Initial stakeholder discussions are leading to an understanding that advanced semiconductors with high-performance capabilities (in computing and RF) will be necessary to enable high-speed data transfer and operate at high frequencies.

• This analysis aims to understand the changes expected in 6G wireless communication from a context of the semiconductor industry, with specific focus on RAN, and the edge.
• From a component perspective, the analysis focuses on the AI-processors, and the key RF components required at the network RAN and the edge.
• The analysis does not cover the changes expected in discrete, analog, memory, optical, and sensing products.
• It aims to provide a qualitative view based on the developments during the study period and is subject to change in the future.
• It does not aim to provide a quantitative overview of the market potential.

Author: Prabhu Karunakaran

Why is it Increasingly Difficult to Grow?

The Strategic Imperative 8™

The Impact of the Top 3 Strategic Imperatives on the 6G Semiconductors Industry

Growth Opportunities Fuel the Growth Pipeline Engine™

Primary Findings

Scope of Analysis

6G—Overview of Cellular Evolution and Desired 6G Network Characteristics

Why 6G? Why Now?

6G Roadmap to Commercialization

6G—Integrated Technology Roadmap

Growth Drivers

Growth Restraints

6G Ecosystem

Why are AI Processors Critical for 6G?

Infusing AI into RAN for the Future of Telecom—Open Radio Access Network (ORAN) Infrastructure

AI in 6G Network Infrastructure—Emergence of AI-RAN

Edge Computing

Edge AI in 6G—Potential Application Universe

Primary Focus Areas for Edge AI Chipsets in the 6G Network

Understanding Current Processors to Evaluate 6G Requirements— Primary Companies and Products

AI in 6G—How to Determine Compute Performance Requirements

The Coming of Silicon Photonics (SiPh)

Regional Competency of AI Semiconductors for 6G Networking

Notable Developments, Initiatives, Activities, and Collaborations to Realize 6G Technology

Notable Investments in AI by Semiconductor Companies

The AI-Semiconductor Ecosystem for 6G

Expected Research Efforts in the Next 5 Years

AI in 6G—The Significance of Cybersecurity and Sustainability

RF Semiconductors in 6G—Enabling 100 GHz and Higher Operational Frequencies

RF Semiconductors in 6G—Process Node Trajectory

RF Semiconductors in 6G—Exploring Materials Beyond Si

RF Semiconductors in 6G—Exploring Materials Beyond Si: GaN

RF Semiconductors in 6G—Exploring Materials Beyond Si: InP

RF Semiconductors in 6G—Advanced Packaging Technologies

RF Semiconductors in 6G—GaN and InP Gaining R&D Traction for Application in Next-gen Wireless Technology

RF in 6G—Primary Products Enabling the Research and Development of 6G

RF in 6G Investments and R&D Initiatives that Semiconductor Companies Have Announced

RF in 6G—Primary Regional Initiatives and Investments

RF in 6G—Ultra-wide Bandgap (UWBG) Semiconductors

The AI Semiconductor Ecosystem in 6G

6G Research and Collaboration Initiatives by Primary Regions

6G Research and Collaboration Initiatives by Primary Regions (continued)

6G Research and Collaboration Initiatives by Primary Regions (continued)

6G Patent Applications by Region (2019–2021)

Semiconductors for 6G—Context of Opportunities by Primary Applications: AVs and Smart Manufacturing

Semiconductors for 6G—Context of Opportunity by Primary Applications: Healthcare and Smart Cities

Application Profile—Industry Metaverse

Application Profile—Mobility

Growth Opportunity 1—Cognitive Intelligence at the Core and Edge

Growth Opportunity 1—Cognitive Intelligence at the Core and Edge (continued)

Growth Opportunity 2—Application-specific Chipsets

Growth Opportunity 2—Application-specific Chipsets (continued)

Growth Opportunity 3—Leverage Government Funding and Policies

Growth Opportunity 3—Leverage Government Funding and Policies (continued)

List of Exhibits

Legal Disclaimer

List of Figures
  • 6G Semiconductors: Growth Drivers, Global, 2024–2033
  • 6G Semiconductors: Growth Restraints, Global, 2024–2033
  • RF Semiconductors in 6G: Compound Semiconductor Patents Published, Global, 2020–2022
  • Semiconductors in 6G: 6G Patent Applications, Global, 2018–2020
  • 6G: Patent Publication, Percent Patent Publication by Jurisdiction, Global, 2019–2021
  • Semiconductors in 6G: 5G Patent Applications, Global, 2010–2012
  • Automotive Vision 2030: Addressable Market Opportunity for Automotive Connected Cars IVP, Global, 2025 and 2030
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Wireless communication systems rely on semiconductor components, such as PAs, LNAs, and transceivers (together known as RF FEMs), to process signals to and from the radio unit (RU), baseband unit (BBU), and the network core to ensure customers receive the radio signals that carry the data and services. The communication system relies on other semiconductor components, such as antenna integrated circuits (ICs), envelope trackers, microprocessors, analog devices, and optical components, to process signals as necessary. The type of semiconductors that wireless telecom communication uses has not changed much with the 2G to 5G evolution of technologies. However, the semiconductor components performance requirements have increased. Hence, the designs, materials, manufacturing, and packaging technologies have evolved with each new wireless communication generation. Because 5G wireless technology is in the deployment stage, industry leaders have begun discussions about developing the next-gen wireless technology (6G) and plan to begin early commercialization in 2030. The dawn of 6G will represent a new era of communication that will provide new services beyond data. The study discusses distributed and federated learning at the edge, co-inferencing between edge and core, autonomous functioning of end devices, the development of AI-powered human-centric telecom services, joint communication, computing, sensing, and control, and several other concepts, which represent a transformation from radio access network (RAN) architecture to services. To develop 6G, industry stakeholders are collaborating to plan the components and building blocks of each sub-technology that will lead to the development of the next-gen wireless technology. Initial stakeholder discussions are leading to an understanding that advanced semiconductors with high-performance capabilities (in computing and RF) will be necessary to enable high-speed data transfer and operate at high frequencies. This analysis aims to understand the changes expected in 6G wireless communication from a context of the semiconductor industry, with specific focus on RAN, and the edge. From a component perspective, the analysis focuses on the AI-processors, and the key RF components required at the network RAN and the edge. The analysis does not cover the changes expected in discrete, analog, memory, optical, and sensing products. It aims to provide a qualitative view based on the developments during the study period and is subject to change in the future. It does not aim to provide a quantitative overview of the market potential. Author: Prabhu Karunakaran
More Information
Deliverable Type Market Research
Author Prabhu Karunakaran
Industries Electronics and Sensors
No Index No
Is Prebook No
Keyword 1 6G Wireless Technology Market
Keyword 2 6G Technology Market
Keyword 3 6G Market
List of Charts and Figures 6G Semiconductors: Growth Drivers, Global, 2024–2033~ 6G Semiconductors: Growth Restraints, Global, 2024–2033~ RF Semiconductors in 6G: Compound Semiconductor Patents Published, Global, 2020–2022~ Semiconductors in 6G: 6G Patent Applications, Global, 2018–2020~ 6G: Patent Publication, Percent Patent Publication by Jurisdiction, Global, 2019–2021~ Semiconductors in 6G: 5G Patent Applications, Global, 2010–2012~ Automotive Vision 2030: Addressable Market Opportunity for Automotive Connected Cars IVP, Global, 2025 and 2030~
Podcast No
WIP Number K979-01-00-00-00