Innovations in 3D Integrated Circuits - Microelectronics TOE

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This issue covers innovations in 3D Integrated Circuits (ICs) with insights on IP trends, competitive landscape, growth drivers, applications impacted. Innovations profiled include a cooling technique for 3D ICs, a thermo compression bond technology, an eight-layer 3D IC wafer stack, and a 3D chip stacking technology and Network on chip framework.The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus th

Table of Contents

Innovations in 3D Integrated Circuits - Microelectronics TOEInnovations in 3D Integrated CircuitsCooling Technique for 3D-Stacked Integrated CircuitsThermo Compression Bonding Technology for 3D Integrated CircuitsEight-layer 3D Integrated Circuit Wafer Stack3D Chip Stacking Technology and Network-on-chip (NoC) FrameworkStrategic PerspectivesStrategic PerspectivesStrategic Perspectives Industry Contacts

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