Innovations in AI, Advanced Data Storage, Displays, AR/VR, System-on-chips, Smart Textiles, GaN Electronics, and Silicon Photonics

Innovations in AI, Advanced Data Storage, Displays, AR/VR, System-on-chips, Smart Textiles, GaN Electronics, and Silicon Photonics

RELEASE DATE
12-Apr-2019
REGION
Global
Research Code: D777-00-A9-00-00
SKU: ES01091-GL-TA_23071

$950.00

Special Price $712.50 save 25 %

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ES01091-GL-TA_23071

$950.00

$712.50 save 25 %

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Description

This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in AI-chipsets, wearables, wireless charging VCSELs, advanced data storage, and HUDs. Innovations include bio-impedance analysis tracker to measure body composition, quantum dot-based smart diffuser, heads-up display for flight data, non-volatile memory using silicon oxide, digitally controlled RF GaN amplifier, 3D chip packaging, and automated reactor technology for VCSEL production.

The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Keywords: AI chipset, artificial intelligence, AR, augmented reality, GaN, gallium nitride, Graphene, photodetector, MRAM, flash memory, LED, SSD, solid state drive, multi-view display, parallel reality, augmented reality, AR glasses, virtual reality, nanowire LED, SoC micro-LED, VR, smart textiles

Table of Contents

Innovations in Heads-up Displays, Multi-view Displays, Optical Phototransistors, Smart Switches, Advanced Memory Storage, and Wireless Charging

  • Flash Array Storage Enables Improved Performance and Low Power Consumption
  • Application Diversity and Analyst Viewpoint
  • Parallel Reality Display That Enables Viewing Multiple Images by Different People
  • Application Diversity and Analyst Viewpoint
  • AR-VR Hybrid Glasses with Advanced Positional Tracking Feature Finds Applications in Gaming
  • Application Diversity and Analyst Viewpoint
  • Nanowire-based LEDs Enable High Intensity Electroluminesence
  • Application Diversity and Analyst Viewpoint
  • 4K VR Headset for Enterprise Applications
  • Applications of Extended Reality
  • HDR SoC for Security Cameras
  • Applications of Multi-core SoCs and Analyst Viewpoint
  • Micro-LED Enabled Monitor for Professionals
  • Applications of Micro-LED
  • Self-powered Smart Textiles with Display Module
  • Applications of E-textiles and Growth Opportunities
  • Graphene-silicon Device for Photonic Applications
  • Impact Across Various Industries and Growth Opportunities
  • Embedded MRAM Technology for Embedded Applications
  • Impact Across Various Industries and Growth Opportunities
  • Gallium Nitride-based SiP Technology
  • Impact Across Various Industries and Growth Opportunities
  • Novel Artificial Intelligence Hardware Platform for AI-based Applications
  • Impact Across Various Industries and Growth Opportunities
  • Key Contacts
  • Key Contacts
  • Key Contacts
  • Your F&S Thought Leader
Related Research
This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in AI-chipsets, wearables, wireless charging VCSELs, advanced data storage, and HUDs. Innovations include bio-impedance analysis tracker to measure body composition, quantum dot-based smart diffuser, heads-up display for flight data, non-volatile memory using silicon oxide, digitally controlled RF GaN amplifier, 3D chip packaging, and automated reactor technology for VCSEL production. The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: AI chipset, artificial intelligence, AR, augmented reality, GaN, gallium nitride, Graphene, photodetector, MRAM, flash memory, LED, SSD, solid state drive, multi-view display, parallel reality, augmented reality, AR glasses, virtual reality, nanowire LED, SoC micro-LED, VR, smart textiles
More Information
No Index No
Podcast No
Industries Electronics and Sensors
WIP Number D777-00-A9-00-00
Is Prebook No
Ti Codes D773,D900,D901,D904,D909,D90A,D90D,D90E,D911,D913,D914,D915,D917,D918,D91B,D91C,D920,D922,D924,D925,D928,D930,D934,D941,D943,D944,D947-TI