Innovations in AI Processors, Integrated Photonics Devices, Nanowire Diodes, and Distributed Antenna Systems

Innovations in AI Processors, Integrated Photonics Devices, Nanowire Diodes, and Distributed Antenna Systems

RELEASE DATE
11-Oct-2019
REGION
Global
Research Code: D777-00-AF-00-00
SKU: ES01125-GL-TA_23692

$950.00

Special Price $712.50 save 25 %

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ES01125-GL-TA_23692

$950.00

$712.50 save 25 %

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Description

This Microelectronics TechVision Opportunity Engine (TOE) profiles advancements in profiles advancement in AI processor, integrated photonics device, nanowire diode, distributed antenna systems. Innovations include advancements in photonic devices, optical communication, antenna systems, AI chipsets, micro-LED, VCSEL, semiconductor fabrication, transistors, and laser printing technology.

The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Keywords: AI processor, AI chip, photonics, nanowire, antenna, micro-LED, VCSEL, laser printing, molecular beam epitaxy, Free Space Optical Communications, FSOC

Table of Contents

Innovations in AI Processors, Integrated Photonics Devices, Nanowire Diodes, and Distributed Antenna Systems

  • Integrated Photonics Device Finds Applications in Deep Learning
  • Application Diversity and Analyst Viewpoint
  • Distributed Antenna System Enables Easy Upgrade to Higher Frequency Bands
  • Application Diversity and Analyst Viewpoint
  • Nanowire Backward Diode with High Sensitivity Finds Applications in 5G Communication
  • Application Diversity and Analyst Viewpoint
  • AI Chip Achieves Superior Performance Finding Applications in Real-time Operations
  • Application Diversity and Analyst Viewpoint
  • Micro-LED Growth Technology to Combine Blue and Green Epitaxy on a Single Wafer
  • Applications of Micro-LEDs
  • FSOC Units for Long-range Seamless Internet Connectivity
  • Applications of FSOC
  • III-V-integrated Silicon Chip for Optoelectronic and 5G Applications
  • Applications of 5G Chipsets
  • Advanced Inspection Tool to Identify Invisible VCSEL Defects
  • Applications of VCSEL
  • Molecular Beam Epitaxy Technology for Developing GaN-on-Silicon Wafers
  • Impact Across Various Industries and Growth Opportunities
  • Single Transistor Static Random Access Memory Technology for Low Power Applications
  • Impact Across Various Industries and Growth Opportunities
  • Complimentary Electron Beam Technology for Semiconductor Fabrication
  • Impact Across Various Industries and Growth Opportunities
  • Novel Laser Printing Technology for Developing Waterproof Electronic Textiles
  • Impact Across Various Industries and Growth Opportunities
  • Key Contacts
  • Key Contacts
  • Key Contacts
  • Your F&S Thought Leader
Related Research
This Microelectronics TechVision Opportunity Engine (TOE) profiles advancements in AI processor, integrated photonics device, nanowire diode, distributed antenna systems. Innovations include advancements in photonic devices, optical communication, antenna systems, AI chipsets, micro-LED, VCSEL, semiconductor fabrication, transistors, and laser printing technology. The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Keywords: AI processor, AI chip, photonics, nanowire, antenna, micro-LED, VCSEL, laser printing, molecular beam epitaxy, Free Space Optical Communications, FSOC
More Information
No Index No
Podcast No
Industries Electronics and Sensors
WIP Number D777-00-AF-00-00
Is Prebook No