This issue of Microelectronics TOE covers recent developments in antennas, solid state supercapacitors, and Li-Fi communication. Innovations profiled include microfabricated wideband low-profile antenna arrays for terahertz communication by the City University of Hong Kong, a thermophoresis-based solid state supercapacitor for wearables by the Texas A&M University, a wireless-enabled valve position indicator technology for nuclear power plants by Idaho National Laboratory, structurally integrated antennas for 5G communication systems by Xidian University, and a Li-Fi-based wireless system for automotive communication by the SRM university.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Keywords: Antenna, supercapacitors, terahertz communication, 5G communication, Li-Fi