Innovations in Antennas, Solid State Supercapacitors, and Li-Fi Communication

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This issue of Microelectronics TOE covers recent developments in antennas, solid state supercapacitors, and Li-Fi communication. Innovations profiled include microfabricated wideband low-profile antenna arrays for terahertz communication by the City University of Hong Kong, a thermophoresis-based solid state supercapacitor for wearables by the Texas A&M University, a wireless-enabled valve position indicator technology for nuclear power plants by Idaho National Laboratory, structurally integrated antennas for 5G communication systems by Xidian University, and a Li-Fi-based wireless system for automotive communication by the SRM university. The Microelectronics TechVision Opportunity Engine (TOE) captures glob

Table of Contents

Innovations in Antennas, Solid State Supercapacitors, and Li-Fi CommunicationRecent Developments in Antennas, Solid State Supercapacitors and Li-Fi CommunicationMicrofabricated Wideband Low-profile Antenna Arrays for Terahertz CommunicationThermophoresis-based Solid State Supercapacitor for WearablesWireless-enabled Valve Position Indicator Technology for Nuclear Power PlantsStructurally Integrated Antennas for 5G Communication SystemsLi-Fi-based Wireless System for Automotive CommunicationIndustry Contacts




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