Innovations in Encapsulation Technologies for Printed Electronics (Technical Insights)

Innovations in Encapsulation Technologies for Printed Electronics (Technical Insights)

9 Dimensional Analysis--Preventing Degradation of Organic Electronics with Reliable Encapsulation

RELEASE DATE
05-Dec-2013
REGION
Global
Research Code: D513-01-00-00-00
SKU: CM01086-GL-TR_17538
$4,950.00
In stock
SKU
CM01086-GL-TR_17538
$4,950.00
DownloadLink

Pay by invoice

ENQUIRE NOW

Description

Printed electronics has resulted in cheaper manufacturing of electronic devices. Moreover by using plastic substrates, flexible electronics can also be printed. With printed electronics, devices such as Organic Light Emitting Diodes(OLEDs) and Organic Photo Voltaic(OPV) has potential to change display, lighting and energy harvesting applications landscape. But the active components in these devices react with moisture and oxygen, resulting in degradation of quality. To enable long lifetime of such printed electronics devices proper encapsulation is required. This research service analyses technology trends and market opportunities of different encapsulation technologies for printed electronic devices from nine dimensions governing adoption.

Table of Contents

Nine-Pronged Technology Assessment

  • Innovations in Encapsulation Technologies for Printed Electronics--9 Dimensional Analysis
Related Research
Printed electronics has resulted in cheaper manufacturing of electronic devices. Moreover by using plastic substrates, flexible electronics can also be printed. With printed electronics, devices such as Organic Light Emitting Diodes(OLEDs) and Organic Photo Voltaic(OPV) has potential to change display, lighting and energy harvesting applications landscape. But the active components in these devices react with moisture and oxygen, resulting in degradation of quality. To enable long lifetime of such printed electronics devices proper encapsulation is required. This research service analyses technology trends and market opportunities of different encapsulation technologies for printed electronic devices from nine dimensions governing adoption.
More Information
No Index Yes
Podcast No
Author Sumit Pal
Industries Chemicals and Materials
WIP Number D513-01-00-00-00
Is Prebook No