Innovations in Gypsum Board Measurement, Magnetic Angle Sensors, Non-contact Displacement Sensors, Integrated Sensor Nodes, and Construction Site Sensing

Innovations in Gypsum Board Measurement, Magnetic Angle Sensors, Non-contact Displacement Sensors, Integrated Sensor Nodes, and Construction Site Sensing

RELEASE DATE
06-Jul-2018
REGION
Global
Research Code: D727-00-81-00-00
SKU: TM00536-GL-TA_22205
$250.00
In stock
SKU
TM00536-GL-TA_22205
$250.00
DownloadLink

Pay by invoice

ENQUIRE NOW

Description

This issue of Sensor TechVision TOE depicts innovations in laser sensing for gypsum board measurement, magnetic angle sensors, eddy current sensors for linear displacement sensing, sensor nodes, and construction sensors.

Sensor TechVision Opportunity Engine (TOE) captures global sensor-related innovations and developments on a weekly basis. Innovations are directed toward developing smart and intelligent sensors with functionalities beyond sensing. Research focus areas include: low power sensors (energy harvesting), industrial automation sensors (M2M, vision sensor), ubiquitous sensor (WSN, sensor fusion), smart sensors (wearables, quantified self), high sensitivity and smaller size (MEMS, nanosensors), and improved security (CBRNE, terahertz). The need for low power, smaller, lighter sensors with enhanced performance attributes and minimal false alarms is driving innovations in the sensors space.
The Sensors and Instrumentation cluster covers innovations pertaining to technologies such as wireless sensors and networks, energy harvesting, haptics and touch, MEMS and nanosensors, Terahertz, ubiquitous/smart sensors, CBRNE, quantified-self, sensor fusion, M2M communications, and drones.

Keywords: Gypsum measurement, laser sensors, magnetic sensors, angle sensors, rotary position sensors, sensor nodes, temperature sensors, light sensors, humidity sensors, construction

Table of Contents

Recent Developments in Sensor Technologies

  • More Accurate Gypsum Board Measurement
  • Protecting Angle Sensors from Leakage
  • Simplified Precision Sensor for Position/Displacement/Proximity
  • Bluetooth Integrates Multiple Sensors in Single Node
  • Measuring Construction Site Conditions
  • Industry Contacts
Related Research
This issue of Sensor TechVision TOE depicts innovations in laser sensing for gypsum board measurement, magnetic angle sensors, eddy current sensors for linear displacement sensing, sensor nodes, and construction sensors. Sensor TechVision Opportunity Engine (TOE) captures global sensor-related innovations and developments on a weekly basis. Innovations are directed toward developing smart and intelligent sensors with functionalities beyond sensing. Research focus areas include: low power sensors (energy harvesting), industrial automation sensors (M2M, vision sensor), ubiquitous sensor (WSN, sensor fusion), smart sensors (wearables, quantified self), high sensitivity and smaller size (MEMS, nanosensors), and improved security (CBRNE, terahertz). The need for low power, smaller, lighter sensors with enhanced performance attributes and minimal false alarms is driving innovations in the sensors space. The Sensors and Instrumentation cluster covers innovations pertaining to technologies such as wireless sensors and networks, energy harvesting, haptics and touch, MEMS and nanosensors, Terahertz, ubiquitous/smart sensors, CBRNE, quantified-self, sensor fusion, M2M communications, and drones. Keywords: Gypsum measurement, laser sensors, magnetic sensors, angle sensors, rotary position sensors, sensor nodes, temperature sensors, light sensors, humidity sensors, construction
More Information
No Index No
Podcast No
Industries Test and Measurement Instrumentation
WIP Number D727-00-81-00-00
Is Prebook No
Ti Codes D723,D901,D902,D903,D904,D909,D90A,D90C,D90D,D90E,D90F,D911,D912,D913,D914,D915,D918,D91B,D91C,D920,D924,D926,D933,D935,D944,D947-TI