Innovations in High-temperature Electronics, Integrated Optics, and Underwater Communication Systems

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This issue of Microelectronics TOE covers recent developments in high-temperature electronics, integrated optics, and underwater communication systems. Innovations profiled include flexible OTFTS for high-temperature electronics by the Beihang University, contactless resonant inductive coupling-based probes for integrated circuits by the University of Windsor, frequency domain pilot multiplexing techniques of SC-FDE with less complexity by the South China University of Technology, an optics-based underwater wireless communication system by the Zhejiang University, and a heat dissipation system for integrated optics by Hitachi Ltd.The Microelectronics TechVision Opportunity Engine (TOE) captures global electroni

Table of Contents

Innovations in High-temperature Electronics, Integrated Optics, and Underwater Communication SystemsDevelopments in High Temperature Electronics, Integrated Optics and Underwater Communication SystemFlexible OTFTs for High-temperature ElectronicsContactless Resonant Inductive Coupling-based Probes for Integrated CircuitsFrequency Domain Pilot Multiplexing Techniques of SC-FDE with Less ComplexityOptics-based Underwater Wireless Communication SystemHeat Dissipation System for Integrated OpticsIndustry Contacts

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