This issue of Microelectronics TOE covers recent developments in high-temperature electronics, integrated optics, and underwater communication systems. Innovations profiled include flexible OTFTS for high-temperature electronics by the Beihang University, contactless resonant inductive coupling-based probes for integrated circuits by the University of Windsor, frequency domain pilot multiplexing techniques of SC-FDE with less complexity by the South China University of Technology, an optics-based underwater wireless communication system by the Zhejiang University, and a heat dissipation system for integrated optics by Hitachi Ltd.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Keywords: High-temperature electronics, underwater communication, integrated circuit, integrated optics