Innovations in System-on-Chip

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This issue of Microelectronics TOE covers recent developments in system on-chip (SLC). Innovations profiled include system-on-chip supporting multiple protocols by Qorvo Inc., bluetooth 5.0 ready SoC by Nordic Semiconductor, bluetooth audio SoC with active noise cancelling technology by Qualcomm Incorporated, and bluetooth low energy (BLE) single-mode system-on-chip by STMicroelectronics.

The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Keywords: System-on-chip, SoC, system-on-a-chip, single chip module

Table of Contents

Innovations in System-on-ChipInnovations in System-on-chipSystem-on-Chip Supporting Multiple ProtocolsBluetooth 5.0 Ready SoCBluetooth Audio SoC with Active Noise Cancelling Technology Bluetooth Low Energy (BLE) Single-mode System-on-ChipStrategic PerspectivesStrategic InsightsStrategic Insights (continued)Industry Contacts




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