This issue of Microelectronics TOE covers recent developments in transistors, organic semiconductors, and hyperspectral imaging. Innovations profiled include single-molecule silicon circuitry by the University of Barcelona (Spain) and the Curtin University (Australia), 3D Poly-Si thin film transistors by National Nano Device Laboratories, doping of an organic crystal by the National Institutes of Natural Sciences, virtual hyperspectral imaging for determining plant health by the Purdue University, and hyperspectral imaging systems by Corning Inc.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Keywords: Thin-film transistor, TFT, hyperspectral imaging, organic crystal, silicon circuitry