Innovations in Wearables, 5G Communication, Compound Semiconductors, Transistors, Li-Fi, and AI chipsets

Innovations in Wearables, 5G Communication, Compound Semiconductors, Transistors, Li-Fi, and AI chipsets

RELEASE DATE
06-Sep-2019
REGION
Global
Research Code: D777-00-AE-00-00
SKU: ES01116-GL-TA_23548

$950.00

Special Price $712.50 save 25 %

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SKU
ES01116-GL-TA_23548

$950.00

$712.50 save 25 %

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Description

This Microelectronics TechVision Opportunity Engine (TOE) profiles advancements in in wearables, 5G communication, compound semiconductors, transistors, Li-Fi and AI chipsets. Innovations include advancements in holographic lithography for semiconductor fabrication, holographic beamforming technology for 5G communication, SiC in power electronics, wearable electronics, flexible differential amplifiers, visible light communication, backlighting, AI chipsets, and smart fabrics.

The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Keywords: Wearables, 5G, compound semiconductor, transistor, Li-Fi, AI chip, artificial intelligence, holographic lithography, fabrication, beamforming, silicon carbide, SiC, power electronics, amplifier, visible light communication, smart fabrics, backlighting, smart watch, electrocardiac Signals, activity monitoring, nanomembrane

Table of Contents

Innovations in Wearables, 5G Communication, Compound Semiconductors, Transistors, Li-Fi, and AI chipsets

  • Sub-wavelength Holographic Lithography for Semiconductor Fabrication
  • Impact Across Various Industries and Growth Opportunities
  • Holographic Beamforming Technology for 5G Communication
  • Impact Across Various Industries and Growth Opportunities
  • Breakthrough Silicon Carbide Technology for Power Electronic Applications
  • Impact Across Various Industries and Growth Opportunities
  • Metal Oxide Semiconductor Nanomembrane for Wearable Electronics
  • Impact Across Various Industries and Growth Opportunities
  • Thread-based Transistor Enables Tracking of Biomarkers
  • Application Diversity and Analyst Viewpoint
  • Wearable Sleep and Activity Monitoring Ring Helps Improve Health of Individual
  • Application Diversity and Analyst Viewpoint
  • Flexible Differential Amplifier Enables Monitoring of Electrocardiac Signals Without Noise Disturbances
  • Application Diversity and Analyst Viewpoint
  • Wearable Device that can be Paired with Smartwatches Enables Fitness Training
  • Application Diversity and Analyst Viewpoint
  • Li-Fi-enabled High-Speed Internet for Seamless Connectivity
  • Applications of Li-Fi
  • Power Efficient Backlighting for Notebooks and Tablets
  • Applications of Micro-LEDs
  • AI-enabled Chipset for Enhanced Edge Applications
  • Applications of AI Chipsets
  • Self-Powered Smart Fabric for Operating Electronic Devices
  • Applications of E-textiles
  • Key Contacts
  • Key Contacts
  • Key Contacts
  • Your F&S Thought Leader
Related Research
This Microelectronics TechVision Opportunity Engine (TOE) profiles advancements in wearables, 5G communication, compound semiconductors, transistors, Li-Fi and AI chipsets. Innovations include advancements in holographic lithography for semiconductor fabrication, holographic beamforming technology for 5G communication, SiC in power electronics, wearable electronics, flexible differential amplifiers, visible light communication, backlighting, AI chipsets, and smart fabrics. The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Keywords: Wearables, 5G, compound semiconductor, transistor, Li-Fi, AI chip, artificial intelligence, holographic lithography, fabrication, beamforming, silicon carbide, SiC, power electronics, amplifier, visible light communication, smart fabrics, backlighting, smart watch, electrocardiac Signals, activity monitoring, nanomembrane
More Information
No Index No
Podcast No
Industries Electronics and Sensors
WIP Number D777-00-AE-00-00
Is Prebook No