Materials and Process Innovations for Digital Printing, Electronics, Direct Imaging, and Multisensing Applications

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This issue of High-Tech Materials covers materials and process innovations for digital printing, electronics, direct imaging, and multisensing applications. These innovations can be used in a wide variety of applications such as food packaging, food safety and quality control, high-heat applications, electronics, wearables, building and construction, and printed circuit boards (PCBs). The High-Tech Materials TechVision Opportunity Engine (TOE) provides intelligence on technologies, products, processes, applications, and strategic insights on various materials across industries. Some material technologies include lightweight materials, bio–based materials, ceramics, smart materials, fibers, nanomaterials, resp

Table of Contents

Materials and Process Innovations for Digital Printing, Electronics, Direct Imaging, and Multisensing ApplicationsAdvances in Materials and Processes for Industrial Applications Inkjet Printing Machine with In-line E-beam Curing System for Printing Inks Nano-optical Filters Deposited on CMOS Silicon for Multisensing Applications Biobased Polyurethane Thermosets for More Sustainable Coatings Deposition Process for Resilient Layers on Flexible SubstratesSolder Resists for Direct Imaging and High-temperature ApplicationsKey ContactsKey Contacts




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