Microelectronics Technology--Innovations in Printed Electronics

USD 250.00

* Required Fields

USD 250.00


Be the first to review this product

This issue of Microelectronics Technology TechVision Opportunity Engine (TOE) profiles developments in printed electronics. It also provides strategic insights on IP activity, Target Applications, Growth factors, adoption barriers, and key companies to watch out for in 2016. Innovations profiled include a 3D printed supercapacitor, ThinFilms's OpenSense technology platform, low cost printing of flexible ICs, and an organic thin film transistor-based fast ring oscillator.The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing,

Table of Contents

Microelectronics Technology--Innovations in Printed ElectronicsInnovations in Printed Electronics3D Printing of Ultralight Supercapacitors Near Field Communication Sensor Tag TechnologyLow Cost Printing of Flexible Integrated CircuitsOrganic Thin Film Transistor-based Fast Ring OscillatorStrategic PerspectivesStrategic Perspectives Strategic Perspectives (continued)Industry Contacts

Related Subscription

• One-2-One Analyst briefing call •
• Access to published and new research deliverables •
• Mid year service review •
• Virtual Analyst briefing •
• GIL conference seats •

Why Frost & Sullivan

Working with the CEO’s growth team to create a vision based on a transformation growth strategy

Creating content-based digital marketing strategies that leverage our research perspective to differentiate and “tell your story”

Tracking over 1000 emerging technologies and analyzing the impact by industry and application to reveal the companies to watch in each sector

The Frost & Sullivan team is based in our 45 global offices and have developed a powerful global understandings of how industries operate on a global level.