Microelectronics Technology--Innovations in Printed Electronics

USD 250

* Required Fields

USD 250


Be the first to review this product

This issue of Microelectronics Technology TechVision Opportunity Engine (TOE) profiles developments in printed electronics. It also provides strategic insights on IP activity, Target Applications, Growth factors, adoption barriers, and key companies to watch out for in 2016. Innovations profiled include a 3D printed supercapacitor, ThinFilms's OpenSense technology platform, low cost printing of flexible ICs, and an organic thin film transistor-based fast ring oscillator.

The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene, 3D ICs, flexible electronics – barrier films/encapsulation and advanced deposition techniques [atomic layer deposition]), smart monitoring and control (advanced displays, touch and haptics), next generation data storage (MRAM, NRAM, PRAM, FRAM), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, wireless charging, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Keywords: printed electronics, printed IC, supercapacitor, organic thin film transistor, RFID, NFC, smart packaging

Table of Contents

Microelectronics Technology--Innovations in Printed ElectronicsInnovations in Printed Electronics3D Printing of Ultralight Supercapacitors Near Field Communication Sensor Tag TechnologyLow Cost Printing of Flexible Integrated CircuitsOrganic Thin Film Transistor-based Fast Ring OscillatorStrategic PerspectivesStrategic Perspectives Strategic Perspectives (continued)Industry Contacts




Related Subscription

Why Frost & Sullivan

Working with the CEO’s growth team to create a vision based on a transformation growth strategy

Creating content-based digital marketing strategies that leverage our research perspective to differentiate and “tell your story”

Tracking over 1000 emerging technologies and analyzing the impact by industry and application to reveal the companies to watch in each sector

The Frost & Sullivan team is based in our 45 global offices and have developed a powerful global understandings of how industries operate on a global level.