This issue of Microelectronics Technology TechVision Opportunity Engine (TOE) profiles developments in printed electronics. It also provides strategic insights on IP activity, Target Applications, Growth factors, adoption barriers, and key companies to watch out for in 2016. Innovations profiled include a 3D printed supercapacitor, ThinFilms's OpenSense technology platform, low cost printing of flexible ICs, and an organic thin film transistor-based fast ring oscillator.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene, 3D ICs, flexible electronics – barrier films/encapsulation and advanced deposition techniques [atomic layer deposition]), smart monitoring and control (advanced displays, touch and haptics), next generation data storage (MRAM, NRAM, PRAM, FRAM), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, wireless charging, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Keywords: printed electronics, printed IC, supercapacitor, organic thin film transistor, RFID, NFC, smart packaging