Microelectronics Technology--Innovations in Printed Electronics

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This issue of Microelectronics Technology TechVision Opportunity Engine (TOE) profiles developments in printed electronics. It also provides strategic insights on IP activity, Target Applications, Growth factors, adoption barriers, and key companies to watch out for in 2016. Innovations profiled include a 3D printed supercapacitor, ThinFilms's OpenSense technology platform, low cost printing of flexible ICs, and an organic thin film transistor-based fast ring oscillator.The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing,

Table of Contents

Microelectronics Technology--Innovations in Printed ElectronicsInnovations in Printed Electronics3D Printing of Ultralight Supercapacitors Near Field Communication Sensor Tag TechnologyLow Cost Printing of Flexible Integrated CircuitsOrganic Thin Film Transistor-based Fast Ring OscillatorStrategic PerspectivesStrategic Perspectives Strategic Perspectives (continued)Industry Contacts




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