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Innovations in Wearables, 5G Communication, Compound Semiconductors, Transistors, Li-Fi, and AI chipsets

This Microelectronics TechVision Opportunity Engine (TOE) profiles advancements in in wearables, 5G communication, compound semiconductors, transistors, Li-Fi and AI chipsets. Innovations include advancements in holographic lithography for semiconductor fabrication, holographic beamforming technolog...

USD 950.00

Innovations in GaNtronics, 5G Chipsets, Transistors, Millimeter Wave, and MicroLED Displays

This Microelectronics TechVision Opportunity Engine (TOE) profiles advancement in GaNtronics, 5G chipsets, transistors, millimeter wave, and microLED displays. Innovations include gallium nitride power semiconductors, microLED, transistors, augmented reality glasses, 5G chipsets, millimeter wave com...

USD 950.00

Innovations in Organic Semiconductors, Wearables, Holographic Displays, 5G, AI Chipset, and Millimeter Wave Communication

This Microelectronics TechVision Opportunity Engine (TOE) profiles advancement in organic semiconductors, wearables, holographic displays, 5G, AI chipset and millimeter wave (mmWave) communication. Innovations include laser diodes developed using organic semiconductors, processing-in-memory technolo...

USD 950.00

Innovations in Quantum Computing, Wearables, SoC, Antennas, Micro-LED, Millimeter wave, and Compound Semiconductors

This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in quantum computing, wearables, system on a chip (SoC), antennas, micro-LED, millimeter wave, and compound semiconductors. Innovations include a nanomechanical router that enables development of quantum computing, medic...

USD 950.00

Innovations in Wearables, Heads-up Displays, SoC, VCSEL, E-textiles, Augmented Reality, Micro-LED, 5G Chipsets, and Semiconductor Lasers

This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in profiles developments in wearables, heads-up displays, SoCs, VCSELs, E-textiles, augmented reality, Micro-LEDs, 5G chipsets and semiconductor lasers. Innovations include reconfigurable hardware platform with integrate...

USD 950.00

Innovations in AI, Advanced Data Storage, Displays, AR/VR, System-on-chips, Smart Textiles, GaN Electronics, and Silicon Photonics

This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in AI-chipsets, wearables, wireless charging VCSELs, advanced data storage, and HUDs. Innovations include bio-impedance analysis tracker to measure body composition, quantum dot-based smart diffuser, heads-up display fo...

USD 950.00

Innovations in AI chips, wireless charging, smart lighting, Heads-up Displays, VCSELs, and Advanced Data Storage

This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in AI-chipsets, wearables, wireless charging VCSELs, advanced data storage, and HUDs. Innovations include bio-impedance analysis tracker to measure body composition, quantum dot-based smart diffuser, heads-up display fo...

USD 950.00

Innovations in Holographic Displays, AI Accelerators, Protein Switches, Topological Circuits, and VCSEL

This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in holographic displays, AI accelerators, protein switches, topological circuits, and VCSEL. Innovations include topological properties of light realized by fabricating LC circuits based on simple structures, AI accelera...

USD 950.00

Innovations in GaN Transistor, AR Displays, Malaria Screening, Photo Diodes, and Wireless Earbuds

This Microelectronics TOE profiles a novel display technology for augmented reality (AR) applications, gallium nitride (GaN)-based transistors for power conversion systems, an algorithm that turns blood analyzers into malaria screens, eliminating photodiodes’ amplification, and low latency wireles...

USD 250.00

Advancements in Molecular Engineering, Traffic Control Systems, Smart Lighting, and Wafer Bonding

This Microelectronics TechVision Opportunity Engine profiles developments in molecular engineering, traffic control systems, smart lighting, and wafer bonding. Innovations include engineering microelectronic devices on the molecular level, 3D AI identification to relieve traffic jams, a smart light...

USD 250.00