Opportunities for SMT in World Back-End Semiconductor Markets

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This research service studies the opportunities for SMT equipment manufacturers to cater back-end semiconductor markets. The major SMT equipment types covered in this study are screen printers, placement, inspection and soldering equipment. This study discusses about the existing challenges, drivers and restraints, highlighting the technology trends in advanced electronics packaging, die attach and wafer bumping markets. The study gives an comparison between SMT and semiconductor manufacturing processes and wire bonding and flip-chip processes.This research covers the competitive market structure, listing some of the popular end-users of SMT and semiconductor equipments for semiconductor packaging.

Table of Contents

Opportunities for SMT in World Back-End Semiconductor Markets, Executive SummaryMarket OverviewIntroductionMarket DefinitionsMajor Research FindingsSemiconductor Opportunities for SMT Equipment ManufacturersSemiconductor Market FocusSemiconductor Packaging and Test Service ProvidersOpportunities for SMT in World Back-End Semiconductor Markets, Total SMT Opportunities in Back-end MarketsMarket DynamicsSMT and Back-end Semiconductor Package Assembly ProcessesWire Bonding and Flip Chip ProcessesIndustry ChallengesMarket DriversMarket RestraintsSMT Equipment Opportunity AnalysisCompetitive StructureOpportunities for SMT in World Back-End Semiconductor Markets, Strategic Analysis of SMT Opportunities in Wafer Bumping and Back-end Packaging Forecasts and TrendsDie Attach Equipment TrendsAdvanced Electronic Packaging TrendsWafer Bumping- Trends & ApplicationsOpportunities for SMT in World Back-End Semiconductor Markets, AppendixDecision Support Database (DSD) TablesGlobal Semiconductor and Semiconductor Equipment MarketWorld Electronics Component ContributionTelecommunication Contribution to Electronics Industry Consumer Electronics Contribution to Electronics Industry




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