Recent Advances in Microfluidic Technology - Microelectronics TOE

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This issue of Microelectronics TOE covers recent advances in microfluidic technology and provides insights on patents, applications impacted, market landscape, growth factors, and adoption barriers. Innovations profiled include a fabrication process for a polymer-based integrated microfluidic chip by Epigem, a bonding technology at room temperature by Invenios, an air bubble-based microfluidic system by the RMIT University, and a microfluidic system-based smart wearable by Dublin City University.The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smal

Table of Contents

Recent Advances in Microfluidic Technology - Microelectronics TOEInnovations in Microfluidic TechnologyFabrication Process for Polymer-based Integrated Microfluidic ChipBonding Technology at Room Temperature for Microfluidic ChipsAir Bubble-based Microfluidic SystemsMicrofluidic System Enabled Smart WearableStrategic PerspectivesStrategic Perspectives Strategic Perspectives (continued)Industry Contacts

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