Recent Advances in Photonic Integrated Circuit Technologies - Microelectronics TOE

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This issue of Microelectronics TOE covers advances in photonic integrated circuits (PICs). Innovations profiled include a microlenses-based hybrid integration technology by Kaiam Corporation, a CMOS technology enabled PIC Interconnect by Luxtera Inc., a monolithically integrated Indium phosphide-based PIC transceiver by OneChip Photonics Inc., and a customizable photonic integration technology for large volume production by Oclaro Inc.The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wi

Table of Contents

Recent Advances in Photonic Integrated Circuit Technologies - Microelectronics TOEInnovations in Photonic Integrated Circuit TechnologiesMicrolenses-based Hybrid Integration Technology for Photonic Integrated Circuits – CMOS Technology Enabled PIC InterconnectMonolithically Integrated, Indium Phosphide-based PIC TransceiverCustomizable Photonic Integration Technology for Large Volume ProductionStrategic PerspectivesStrategic Perspectives Strategic Perspectives (continued)Industry Contacts

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