This issue of Microelectronics TOE covers advances in structural electronics. Structural electronics integrates electronic devices, sensors, electrical components, and photonic devices that enable structural components in assemblies to have advanced functional value. Innovations profiled in this issue include a water mapping technique in concrete structures, a wireless electronic structural health monitoring system by Civionics, an electricity generating flooring solution by Pavegen, and structural electronics powering up building surfaces by Saule Technologies.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Keywords: Structural electronics, BIPV, energy harvesting, structural health monitoring