World Back-End Semiconductor Manufacturing Technologies (Technical Insights)

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A detailed assessment of research and development in the field of back-end semiconductor manufacturing.

Table of Contents

World Back-End Semiconductor Manufacturing Technologies (Technical Insights), Executive SummaryScope and MethodologyScopeResearch MethodologyKey FindingsWhere is the Back-End Semiconductor Industry HeadedNoteworthy ApplicationsWorld Back-End Semiconductor Manufacturing Technologies (Technical Insights), Technology and Applications ViewpointWafer Bumping Technology Impact AnalysisWafer Bumping--Technology PrimerThe Road to Lead-Free Wafer BumpingLead-Free MaterialsCompeting TechnologiesWafer Bumping Applications ViewpointIndustry Trends in Lead-Free Wafer BumpingNext-Generation Electronic Packaging and Interconnect Technology Impact Analysis Electronic Packaging & Interconnect Technology PrimerConsumer Electronics Applications ViewpointAutomotive Applications ViewpointIndustry Trends--Outsourcing to the Far EastUpcoming Workshops and ConferencesWorld Back-End Semiconductor Manufacturing Technologies (Technical Insights), Technology Adoption Factor AnalysisLead-Free Wafer Bumping Technology--Drivers and ChallengesGrowth DriversTechnology ChallengesElectronic Packaging and Interconnect Technology--Drivers and ChallengesGrowth DriversTechnology ChallengesWorld Back-End Semiconductor Manufacturing Technologies (Technical Insights), Assessment of Global Innovation and OpportunitiesWafer Bumping--Global Innovative DevelopmentsInvestment on Fine Pitch Bumping Scales Up--USAA Cost-Effective Lead-Free Wafer Bump Solution--SingaporeNext-Generation Stud Bumpers Attract Novel Applications--USASynthesis Of Effective Copper-Tin Coated Silver Bumps--TaiwanNovel Lead-Free Bumping Process and Equipment Suits Flipchip Applications--EuropeNovel Bumping Technology For Flip Chip Packages--TaiwanChip Packaging - Global Innovative DevelopmentsChip Packaging R&D On Rise in Europe--ItalyGreen Initiatives Catching Up Globally--SingaporeInitiative For Lead-Free Packaging--USAHigh-Performance; No-Lead Package Suits Automotive Applications--EuropeLead-Free Package Enables Automotive Applications--EuropeNovel 3D Packages Boosts Electronics Applications--EuropeMaterials Research Boosts European Assemblers--EuropeLead-Free Packaging Heats Up Globally--USACreating a Lead-Free World--JapanOther Back-End Technologies--Global Innovative DevelopmentsNovel Chip Testers Enables Reliable Semiconductor Manufacturing--JapanReliability Testing of Microelectronic Chipsets--USALibrary For Chip Testing Enables Better Chip Fabrication--USAWorld Back-End Semiconductor Manufacturing Technologies (Technical Insights), Key Patents and Database of Key Industry ParticipantsKey PatentsPatents Related to Wafer Bumping TechnologiesPatents Related to Electronic Packaging and Interconnect TechnologiesDatabase of Key Industry ParticipantsCompany ContactsUniversities/Research LabsWorld Back-End Semiconductor Manufacturing Technologies (Technical Insights), Frost & Sullivan 2005 Science and Technology AwardsFrost & Sullivan Award for Technology InnovationAward Description Award RecipientFrost & Sullivan Award for Excellence in TechnologyAward DescriptionAward RecipientFrost & Sullivan Award for Excellence in ResearchAward Description Award RecipientFrost & Sullivan Award for Product LeadershipAward Description Award RecipientFrost & Sullivan Award for Technology LeadershipAward Description Award RecipientWorld Back-End Semiconductor Manufacturing Technologies (Technical Insights), Critical Reference TablesDecision Support Database TablesGlobal Mobile Handsets Installed BaseGlobal Semiconductor and Semiconductor Equipment Market Total Portable PC Installed Base Unit Shipment of Digital Cameras--North AmericaUnit Shipment of Camcorders--United StatesUnit Shipment of PDAs--North America




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