World Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights)

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A detailed assessment of research and development in the field of Electronic Packaging

Table of Contents

World Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Executive SummaryOverview; Highlights; and Key FindingsElectronic Packaging--An AnalysisHighlights and Key FindingsScope and MethodologyScope of the Research ServiceMethodologyWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Electronic Packaging--Technology AssessmentPackaging --Primer on TechnologiesTechnology SnapshotTechnology RequirementsGrowth Drivers and Technology ChallengesExisting Technologies--An AnalysisTechnology DescriptionPromising TechnologiesTechnology RestraintsWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Technology Analysis and Developments--Stacked-Die PackagesStacked-Die Packages--An AnalysisTechnology DescriptionSiP Approach in Stacked-Die PackagesTechnology Drivers and ChallengesGlobal Technology Developments--Stacked-Die PackagesDie-Stacking Enables SiP Approach--USAStacking Chips Enables More Functionality in Devices--TaiwanDie-Stacked Packages for Wireless Applications--JapanA Novel Chip Stacking Technique for Portable Applications--USAStacked-Chip Packaging for Next-Generation Devices--JapanStacking Multiple Chips Enables System Integration--USAGlobal Technology Developments--Thermal ManagementLattice Layers for Thermal Management in Systems--USATiny Bubbles for System Cooling--USAWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Technology Analysis and Developments--Stacked PackagesStacked Packages -- An AnalysisTechnology SnapshotSystem-in-Package (SiP) Approach in Stacked PackagesTechnology Drivers and ChallengesGlobal Technology Developments3D Stacking Improves Device Functionality--SingaporeFold-Over Stacked Packages for Next-Generation Devices--USAHigh-Density Packaging for Mobile Applications--USAStacking Packages Ensures Higher Yield--USAAdvanced Packages for DSP and Wireless Applications--USAA Modular SiP Approach--SingaporeWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), System-on-Chip; System-on-Package; Chip-on-Film; and 3D-IC PackagesTechnology DescriptionSystem-on-Chip (SoC) and 3D SoCSystem-on-Package (SoP)Chip-on-Film Package (CoF)Global Technology DevelopmentsThru Silicon Via Interconnection Enables 3D SoC Technology--USASoP Enables System Level Integration--USANovel CoF Package for Next-Generation Display Devices--TaiwanWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Package Architecture; Materials; Interconnect Technologies Package Architecture; Materials; Interconnect TechnologiesFlip-Chip InterconnectionWirebond TechnologyPackage Architecture and MaterialsGlobal Technology Developments --- Interconnect TechnologiesCreating High-Density Interconnects--USAAdvanced Interconnections Enable Better Functionality--NetherlandsThinner Packages with Copper Interconnections--USAGlobal Technology Developments in Packaging Materials--Universities; R&D LabsAdhesives Make More Reliable Die-Attach Process--USASolder Shapes up Nanoassembly--USAChecking Package Stress--USAGet the Lead out of Packages--USAStress Testing CMOS Electronic Packages--USAConductive Plastics Make Smarter Packaging--FinlandWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Future Trends; Consortiums; Mergers and Acquisitions Future Trends in the IndustryNoteworthy R&D Developments and Future TrendsTechnology Timeline -- PredictionsPackaging Consortiums; Mergers; AcquisitionsPackaging ConsortiumsMergers /AcquisitionsWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Patent Analysis; Corporate Profiles; Contact DetailsPatentsPatents Related to 3D PackagesPatents Related to BGA PackagesPatents related to Multi-Chip PackagePatents Related to CSPPatents Related to Interconnect TechnologiesPatents Related to Other Packaging technologiesContact DetailsCorporatesUniversitiesWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Frost & Sullivan 2004 Science and Technology AwardsTechnology Innovation Award DescriptionAward RecipientExcellence in TechnologyAward DescriptionAward RecipientWorld Electronic Packaging Technologies--Analysis of Technological Trends (Technical Insights), Decision Support Database TablesDecision Support Database Tables related to Electronic PackagingGlobal Mobile Handsets Installed Base (Millions): 1996 - 2004Country Share in Total Mobile Handset Sales by Region : 1996 - 2004Global Printed Circuit Board Sales (Million USD): 1998 - 2004GSM Cellular Handsets in Use (Million) by Region: 1996 - 2004CDMA Cellular Handsets in Use (Million) by Region: 1996 - 2004Global PDC and TDMA Cellular Handsets in Use (Million): 1996 - 2004




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