Search results for: '20 packaging'

Connected packaging is rapidly evolving from a functional communication tool into a strategic enabler of transparency, authentication, and intelligent consumer engagement across global value chains. Advances in RFID/NFC, digital watermarks, printed electronics, sensors, and cloud-based digital identity platforms are transforming physical products i...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

There is lot of buzz around phygital (physical plus digital) and Internet of Things (IoT) connected ecosystem. With the evolution of new-age technology, which is built on the foundation of connectivity, efficiency, and increased automation. The retail and packaging industry is gradually moving toward the phygital world. Phygital combines the strate...

Every week, in our Weekly Disrupt blog, we identify the top 10 most disruptive stories of the week and score each one from 1, not disruptive at all to 10, truly disruptive. The Monthly Disrupt is part of the Connected Industries Disrupt Series. This market insight explores the 20 most disruptive stories of the month. In March, healthcare, transpor...

As enterprises execute their hybrid cloud strategies, they are looking to simplify critical functions, such as: --moving applications across various infrastructures --optimizing legacy applications --introducing new functionality and services to legacy and cloud applications Increasingly, they are choosing to build and deploy applications in con...

In a field of more than 100 industry participants in Europe, Frost & Sullivan independently plotted the top 20 cloud contact center companies across two key indices of growth and innovation.

The COVID-19 pandemic accelerated the remote working trend by at least 20 years across Europe. To enable remote workers, digital transformation initiatives that were intended to be rolled out over a period of years instead occurred in weeks or months. In the process, security issues were initially pushed aside or ignored altogether in the rush to e...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...