Search results for: '20 packaging'

Connected packaging is rapidly evolving from a functional communication tool into a strategic enabler of transparency, authentication, and intelligent consumer engagement across global value chains. Advances in RFID/NFC, digital watermarks, printed electronics, sensors, and cloud-based digital identity platforms are transforming physical products i...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

There is lot of buzz around phygital (physical plus digital) and Internet of Things (IoT) connected ecosystem. With the evolution of new-age technology, which is built on the foundation of connectivity, efficiency, and increased automation. The retail and packaging industry is gradually moving toward the phygital world. Phygital combines the strate...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

This study covers market and technology trends and provides market sizing and forecasts for the World Outbound Dialing market. Among the types of outbound (telephony) contact methods are predictive, preview, power dialing. Contact centers are feverishly attempting to maximize their effectiveness to serve customers on inbound and permission-based, o...

Cloud forms a critical part of the digital transformation efforts of enterprises worldwide. Cloud infrastructure, platforms, and applications extend the benefits of flexibility, scale, and cost to IT and business teams. Yet, year after year, we find that organizations report managing costs in the public cloud as a major challenge. Consequently, int...