Search results for: 'Grid Interconnection study'

This study examines key original equipment (OE) suppliers' aftermarket strategies in the rapidly evolving automotive connected, autonomous, shared, and electric (CASE) domain. Spanning Europe (including the 27 European Union countries and the United Kingdom), North America (the United States and Canada), and China, the focus is on 2023 to 2030. The...

The Mobility Technology Opportunity Engine (TOE) provides profiles of innovations related to Fun Utility Vehicle (FUV) Revolutionizing Urban Mobility with Efficient, Sustainable, Electric 3-Wheeled Design, High-definition (HD) Map Cloud Technology, Autonomous Vehicle Technology, Vehicle-to-grid (V2G) Technology and Hybrid-electric Aircraft System.T...

This study of the evolution of integrated inverters in HPCUs covers: • EV charging connector demand and forecast across key regions • Market share analysis by power range and charging operators • Key industry trends, challenges, and regulatory landscape • Strategic insights into stakeholders’ offerings and stakeholders • Technical overview of integ...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

The energy transition is no longer driven solely by cleaner generation technologies; it is increasingly defined by the intelligence, resilience, and strategic control embedded within energy systems. As governments, utilities, infrastructure operators, and industrial stakeholders respond to rising electricity demand, supply chain volatility, and dec...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

The study focuses on the reuse/second life and recycling market for the lithium-ion batteries used in the EVs. It provides an overview of the market trends, geographic resources of lithium, industry challenges, and demand and supply projections of lithium for the automotive sector. Furthermore, this study also looks at feasible reuse/second life ap...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...