Search results for: 'chiplet IP'

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

13 Jul 2023  |  Global  |  Technology Research

Bio-based Adhesives: Technology and IP Analysis

Efforts to Improve Bio-based Adhesives’ Strength, Water Resistance, and Economic Viability Drive R&D Efforts.

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The adhesives industry is evolving, attributed to the stricter implementation of government regulations for volatile organic compounds (VOCs), the ban on toxic chemicals in adhesive manufacturing, and the rising consumer demand for sustainable products. In line with these transformative trends, adhesive manufacturers aim to offer sustainable soluti...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

16 Dec 2024  |  Global  |  Market Research

Connected Off-highway Equipment Market, Global, 2024–2030

The Market is Experiencing Transformational Growth Mainly Due to Customer Preferences and Data-driven Decisions

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The construction, mining, and agricultural equipment industries comprise high-cost equipment that addresses specific requirements and applications; however, these equipment accumulate significant operational and maintenance costs throughout their life cycles. While equipment utilization used to be a concerning metric, the growing labor shortage, re...