Search results for: '20 packaging'

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

20 Jul 2022  |  Asia Pacific  |  Market Research

Asia-Pacific Fixed Broadband Growth Opportunities

Transformative Mega Trends Drive the Growth of Fixed Broadband in Asia-Pacific

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Remote working and online learning have transformed the fixed broadband market in Asia-Pacific. These market trends drove up usage of high-data- and high-bandwidth-intensive applications, such as telecommuting, video conferencing and streaming, which increased the demand for high-speed and reliable internet connectivity. However, the growing adopti...