Search results for: '2020 packaging'

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

Manufacturing companies are constantly looking for new ways to streamline their operations, increase the productivity and profitability of operations. They now seek to optimize one of their own most valuable assets—data. New data grows exponentially because of the increase in the level of networking and connectivity among people and machines/device...

In the age of rising digitalization and Industry 4.0 initiatives, the quest to maintain the highest security possible is ongoing. The global ICS cybersecurity market is witnessing steady growth, with companies focused on enhancing the security and resilience of critical industrial assets. Industrial companies seek to secure and optimize their Oper...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

Industrial production lines are undergoing transformation to adapt to the competitive market. As factory of the future becomes real, inter-connected devices autonomously enable flow of data, allowing automated analysis. Automation requires machines that are highly technologically advanced to derive reliable results. With manufacturing shop floors ...

This research service is a detailed factbook that analyses the current trends in the global welding robotics market. Market estimates in terms of revenue and unit shipment for each end user in each geography and product segment are provided. In addition, revenue and unit shipment forecasts for the same have been provided upto 2020. An analysis of m...