Search results for: 'MOLDED INTERCONNECT DEVICE'

This series offers a comprehensive overview of the latest advancements and transformative trends that companies worldwide have embraced to develop technologies for a new era of mobility. These trends create direct opportunities for companies in sectors such as mobility, supply chain & logistics, health, medical devices & life sciences, aerospace & ...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

Video telematics solutions are poised to become the norm amongst enterprise fleets in the initial phase, owing to reduced vehicle claims, efficient driver exoneration, and higher realized return on investment. Medium and heavy-duty commercial vehicles for long-haul vehicle operations are primarily poised to be early adopters of video telematics, gi...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

The edge AI accelerator market is scaling rapidly as industries demand low-latency, privacy-aware intelligence for autonomous vehicles, industrial automation, smart cameras, robotics, and other applications. Cloud-based inference faces more limits from bandwidth, latency, and data sovereignty concerns, creating a strong pull for on-device AI proces...

The rapid push toward e-mobility is accelerating adoption of advanced power electronics by major OEMs. Power electronics underpin electric vehicle reliability, efficiency, and performance. Core systems, including traction inverters, onboard chargers, and DC-DC converters, are gaining strategic importance, prompting automakers to seek compact, high-...