Search results for: 'package-on-package'

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

US President Donald Trump imposed a 25% tariff on imports of passenger vehicles, light trucks, and certain automotive parts (engines, transmissions, powertrain parts, and electrical components, among them) on March 26, 2025. He also announced a more comprehensive set of “reciprocal tariffs,” starting at 10% on almost all goods from most countries.S...

The United States has levied 25% tariffs on imports from Mexico and Canada—2 markets closely connected to the US auto market. Most brands in the United States depend on Mexico and Canada for sourcing and production. Coupled with retaliatory tariffs, near-term impacts to North American volumes and inflation can be sizable. Firms should prioritize re...

This report examines the cascading impact of the 2026 US–Iran War on the global automotive industry, spanning supply chain disruptions, commodity price shocks, production forecasts, and shifting consumer demand across major markets. The conflict, which began in late February 2026, triggered the closure of the Strait of Hormuz—a chokepoint handling ...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

This study presents a comprehensive overview of the global battery electric vehicle (BEV) market slowdown, with a particular emphasis on developments between 2020 and 2024. It thoroughly examines the deceleration in BEV sales growth, highlighting the growing disparity between production volumes and actual vehicle deliveries. The report contrasts...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...