Search results for: 'semiconductors microelectronics development usa'

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The rapid push toward e-mobility is accelerating adoption of advanced power electronics by major OEMs. Power electronics underpin electric vehicle reliability, efficiency, and performance. Core systems, including traction inverters, onboard chargers, and DC-DC converters, are gaining strategic importance, prompting automakers to seek compact, high-...

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to EV Charging, V2X Platforms, LiDAR, and Autonomous Vehicle Development among others.The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significa...

City transportation systems around the world are undergoing significant transformation due to technological advancements, changing urban landscapes, and evolving expectations from residents. Traffic congestion, air pollution, and inefficient use of resources are common challenges that transport operators across cities are grappling with. To address...

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to C-V2X, LiDAR, Automotive Radar, SoCs and Rechargeable Batteries among others.The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant but...

The edge AI accelerator market is scaling rapidly as industries demand low-latency, privacy-aware intelligence for autonomous vehicles, industrial automation, smart cameras, robotics, and other applications. Cloud-based inference faces more limits from bandwidth, latency, and data sovereignty concerns, creating a strong pull for on-device AI proces...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...