Search results for: 'soc semiconductor market'

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to Battery Intelligence, SoCs, Image Sensors, LiDAR and V2X among others.The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant but potent...

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to SoC, LiDAR, Urban Mobility and Self-driving Systems, among others.The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant but potentiall...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to C-V2X, LiDAR, Automotive Radar, SoCs and Rechargeable Batteries among others.The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant but...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The rapid push toward e-mobility is accelerating adoption of advanced power electronics by major OEMs. Power electronics underpin electric vehicle reliability, efficiency, and performance. Core systems, including traction inverters, onboard chargers, and DC-DC converters, are gaining strategic importance, prompting automakers to seek compact, high-...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

Geopolitics, trade wars, and past semiconductor shocks have turned global, cost‑optimized supply chains into a structural risk, pushing OEMs and Tier Is toward regional hubs, near‑shoring, and local‑for‑local manufacturing to build resilience rather than pure cost efficiency. Europe and the ASEAN region have been the worst hit due to the conflict i...

Global light vehicle demand remained resilient in 2025, supported by the recovery of major automotive markets, strong APAC momentum, and the continued consumer shift toward electrified and utility-focused vehicles. This report evaluates how the global automotive industry is entering 2026 amid geopolitical instability, tariff realignment, weakening ...