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The Asia-Pacific (APAC) Internet of Things (IoT) market is expected to grow at a compound annual growth rate (CAGR) of 22.5% between 2019 and 2026 to reach a market size of $436.80 billion by the end of this forecast period. However, many enterprises remain unclear about the benefits and the maturity of IoT solutions available on the market. This r...

South Korea has one of the highest per capita plastic packaging consumption rates globally, as well as one of the highest rates of collection and recycling. The country is strongly pushing the circular economy of plastic recycling through new policies and initiatives and is building on country-wide programs, such as waste disposal fees based on vol...

Internet of Things (IoT) is no longer considered a hype-based concept. Instead, IoT deployment is finally making headway with both private and public sectors in various industries in the world, and in Asia-Pacific, in particular. The high level of interest in IoT is matched by the increasing readiness of companies and organisations in the region to...

Market estimates, growth estimates, and segmentation are based on existing data, secondary research, and information gathered from interviews in 2018. The base year for the report is 2017. The beverages subsegment is the most digitally mature end market in the F&B sector, followed by meat and dairy. Maturity varies between the subsegments according...

The pervasiveness of digital technologies has reached a state of ubiquity in consumer products. Digitisation is gradually penetrating the manufacturing sector in order to produce cheaper and better consumer products. At times of uncertain and volatile economic conditions, manufacturers are seeking competitive advantages by modernising and upgrading...

The APAC Internet of Things (IoT) market is expected to expand at a compound annual growth rate (CAGR) of 29.3Percentage between 2018 and 2025 to reach a size of $424.2 billion by the end of the forecast period. This study has sized the spending across the entire IoT value chain comprising chips, modules and sensing, connectivity, enablement platfo...