Search results for: 'semiconductor ad check'

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

10 Mar 2017  |  Asia Pacific  |  Market Research

Asia-Pacific Cloud Computing Services Market Analysis, Forecast to 2022

Strong Uptake of Managed Cloud Services Bundled with Value-added Offerings Unlocks Growth Opportunities for Service Providers

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The demand for managed cloud and professional services has been increasing, especially in countries with a mature cloud landscape such as Japan. This arises due to complex Big Data and workloads such as enterprise resource planning (ERP) being increasingly migrated to cloud platforms. The expansion of open source technologies, as well as advances i...

This research service analyzes the intelligent automation (IA) market in Asia-Pacific (APAC). It presents an overview on how artificial intelligence (AI) and robotic process automation (RPA) are gaining significance across key countries in the region, their applications, and some of the drivers and restraints in using these technologies. This stu...

28 Feb 2020  |  Global  |  Market Research

Global Analysis of Industrial Bulk Packaging Market, Forecast to 2026

Inclination Toward Sustainable Offerings, Coupled with Rising Demand for Value-added Products, to Steer the Market Growth

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Conventional industrial bulk packaging products, such as steel and plastic drums, are touted as classic workhorses for storage and transport of a broad range of industrial products across a diverse set of industries. The overall growth in economic activity and industrial output has strongly influenced the growth in the global industrial bulk packag...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This research presents key market participants with business intelligence needed to understand the future of the North American biometrics market in the commercial and government segments. The government segment includes application such as border control, e-ID, and law enforcement while the commercial segment includes applications such as physical...

27 Apr 2018  |  North America  |  Market Research

Automotive ECUs for ADAS and Autonomous Driving Systems, North America and Europe, 2017

E/E Architecture Will Transform from Multiple ECUs to 5 Domain Controllers

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With the advent of autonomous driving, humans are slowly being asked to relinquish control to the vehicle. However, in the near future, as the automotive industry paves the way from manually driven vehicles to fully autonomous vehicles via semi-autonomous vehicles, changes in the vehicle E/E architecture that help achieve this transition should be ...

This study aims to analyse the global connected fleet (commercial vehicle, passenger vehicle fleets, buses, and off-highway vehicle/heavy equipment) market for 2019. The objective of this research is to highlight the 2018 performance of the connected fleet ecosystem with respect to acquisitions, new product developments, OEM introductions and new t...

The automotive industry faces challenges such as regulatory hurdles, electrification, the rise of software-defined vehicles (SDVs), semiconductor shortages, and geopolitical chaos. OEMs and value chain partners are realigning their product strategies, roadmaps, and launch timelines to adapt to these challenges. They have rerouted investments to dev...